Leaded and Lead-Free Solder Paste Evaluation Screening Procedure
Published: |
May 12, 2010 |
Author: |
Ronald C. Lasky, Ph.D., PE; Indium Corporation of America Daryl Santos, Ph.D., Aniket A. Bhave; Binghamton University |
Abstract: |
Numerous studies have shown that greater than 60% of end of line defects in SMT assembly can be traced to solder paste and the printing process. Reflowing adds another 15% or so. In light of this fact, it is surprising that no simplified procedure for solder paste evaluation has been documented. This paper is about such a procedure.... |
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