The Reliability Challenges of QFN Packaging
Published: |
May 27, 2010 |
Author: |
Randy Kong, Cheryl Tulkoff, Craig Hillman (presented at: SMTA China East Conference 2010) |
Abstract: |
The quad flat pack no lead or quad flat non-leaded (QFN) is one of the fastest growing package types in the electronics industry today. While the advantages of QFNs are well documented, concerns arise with its reliability and manufacturability. Acceptance of this package, especially in long-life, severe-environment, high-reliability applications, is currently limited. One of the most common drivers for reliability failures is inappropriate adoption of new technologies, such as the case with QFN. In this presentation, we will review and discuss QFN related reliability concerns and challenges, and propose Physics-of-Failure (PoF) based approaches to allow the confident introduction of QFN components into electronics products.... |
|
|
|
|
|
|
You must be a Company Information:
More articles from DfR Solutions »
- Mar 16, 2022 - Creep Corrosion Of Electronic Assemblies In Harsh Environments
- Mar 02, 2022 - Solderability after Long-Term Storage
- Oct 12, 2021 - Counterfeit Detection Strategies: When to Do It / How to Do It
- Aug 11, 2021 - Coatings and Pottings: A Critical Update
- Aug 13, 2020 - Best Practices in Selecting Coatings and Pottings for Solar Panel Systems; Junction Boxes and Inverters
- See all SMT / PCB technical articles from DfR Solutions »
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
The Reliability Challenges of QFN Packaging article has been viewed 617 times
