Reliability Enhancement of Wafer Level Packages with Nano-Column-Like Hollow Solder Ball Structures

Published:	January 12, 2012
Author:	Ronak Varia, Xuejun Fan
Abstract:	In this paper, hollowed solder ball structures in wafer level packages are investigated. Detailed 3-D finite element modelling is conducted for stress and accumulated inelastic strain energy density or creep strain analysis. Three cases are studied in thi...

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The mission of the Department of Mechanical Engineering at Lamar University is to provide high quality education and meaningful career opportunities for its graduates.

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