Assembly and Rework of Lead Free Package on Package Technology
Published: |
March 22, 2012 |
Author: |
Raymond G. Clark, Joseph D. Poole, TT Electronics - IMS |
Abstract: |
Miniaturization continues to be a driving force in both integrated circuit packaging and printed circuit board laminate technology. In addition to decreasing component pitch (lead to lead spacing), utilization of the vertical space by stacking packages ha... |
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