A Novel Material for High Layer Count and High Reliability Printed Circuit Boards
Published: |
September 27, 2012 |
Author: |
Jie Wan, Junqi Tang, Xianping Zeng |
Abstract: |
First published in the 2012 IPC APEX EXPO technical conference proceedings. Over the past few years a new family of laminate systems has been developed to face the increasing physical demands of withstanding Pb-free soldering processes used in the assembl... |
|
|
|
|
|
|
You must be a Company Information:
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
A Novel Material for High Layer Count and High Reliability Printed Circuit Boards article has been viewed 643 times
davef
October 3, 2012
Hello Jie Wan. In Figure 9: '24 layers 1.0 mm BGA, Thermal shock 288? 3 times wicking,' you show 'wicking.' What is 'wicking?' Is wicking delamination? What's happening there? Is that a through hole wall where the wicking is occurring?