Impact of Dust on Printed Circuit Assembly Reliability
Published: |
May 9, 2013 |
Author: |
Bo Song, Michael H. Azarian and Michael G. Pecht |
Abstract: |
Atmospheric dust consists of solids suspended in air. Dust is well known for its complex nature. It normally includes inorganic mineral materials, water soluble salts, organic materials, and a small amount of water. The impact of dust on the reliability of printed circuit board assemblies (PCBAs) is ever-growing, driven by the miniaturization of technology and the increasing un-controlled operating conditions with more dust exposure in telecom and information industries... First published in the 2012 IPC APEX EXPO technical conference proceedings.... |
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