Reliability Performance of Very Thin Printed Circuit Boards with regard to Different any Layer Manufacturing Technologies.
Published: |
September 19, 2013 |
Author: |
Gerhard Schmid, Martin Fischeneder, Gerhard Stoiber |
Abstract: |
The next generation of smart phones will demand very thin multi-layer boards to reduce the product thickness again. This paper shows three different manufacturing approaches, which can be used for very thin any-layer build-ups. The technological approaches are compared on reliability level – the any-layer copper filled micro-via technology which is to be considered as state of the art technology for high end phones and the ALIVH-C/G technology that is well established in Japan. A test vehicle design featuring test coupons for comprehensive reliability test series has been defined as target application for investigation...... |
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