Challenges in Bare Die Mounting
Published: |
May 8, 2014 |
Author: |
Larry Gilg, Die Products Consortium. |
Abstract: |
Bare die mounting on multi-device substrates has been in use in the microelectronics industry since the 1960s. The aerospace industry’s hybrid modules and IBM’s Solid Logic Technology were early implementations that were developed in the 1960’s. The technologies progressed on a steady level until the mid 1990’s when, with the advent of BGA packaging and chip scale packages, the microelectronics industry started a wholesale move to area array packaging. This paper outlines the challenges for both traditional wire-bond die attached to a printed wiring board (pwb), to the more recent applications of bumped die attached to a high performance substrate.... |
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Challenges in Bare Die Mounting article has been viewed 570 times
anvil1021
May 13, 2014
Nice Paper on COB, wondering if you have given any thought to any new wire bond compatible PCB surface finishes or treatments? New Laminate materials and new wire bond techniques that could be employed in this new age of ours? Cheers, Anvil