Stereo Vision Based Automated Solder Ball Height Detection

Published:

April 16, 2015

Author:

Jinjin Li, Lina J. Karam; School of Electrical, Computer, & Energy Engineering, Arizona State University, Bonnie L. Bennett, Jeff S. Pettinato;Intel Corporation.

Abstract:

Solder ball height inspection is essential to the detection of potential connectivity issues in semi-conductor units. Current ball height inspection tools such as laser profiling, fringe projection and confocal microscopy are expensive, require complicated setup and are slow, which makes them difficult to use in a real-time manufacturing setting. Therefore, a reliable, in-line ball height measurement method is needed for inspecting units undergoing assembly. (...)

In this paper, an automatic, stereo vision based, in-line ball height inspection method is presented. The proposed method includes an imaging setup together with a computer vision algorithm for reliable, in-line ball height measurement....

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Company Information:

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

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