Acceptance Testing Of Low-Ag Reflow Solder Alloys
Published: |
March 10, 2016 |
Author: |
Kris Troxel, Aileen Allen, Elizabeth Elias Benedetto, Rahul Joshi |
Abstract: |
Since the implementation of the European Union RoHS directive in 2006, the electronics industry has seen an expansion of available low-silver lead (Pb)-free1 alloys for wave soldering, miniwave rework, BGA and CSP solder balls, and, more recently, solder pastes for mass reflow. The risks associated with the higher processing temperatures of these low-silver (Ag between 0-3 wt%) solder alloys, such as potential laminate or component damage, increased copper dissolution, and reduced thermal process windows may present manufacturing challenges and possible field reliability risks for original equipment manufacturers (OEMs). In order to take advantage of potential cost reduction opportunities afforded by these new alloys, while mitigating manufacturing and reliability risks, the company has defined test protocols [1-4] that can be used for assessing new Sn-Ag-Cu(SAC), Sn-Ag, and Sn-Cu alloys for general use in electronics. This paper describes initial test results for low-silver alloys using these solder paste alloy assessment protocols for BGAs and leaded components, and the impact of the alloys on printed circuit assembly process windows.... |
You must be a registered user to talk back to us. |
Company Information:
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
Acceptance Testing Of Low-Ag Reflow Solder Alloys article has been viewed 338 times