3D Assembly Process a Look at Today and Tomorrow
Published: |
April 21, 2016 |
Author: |
David Geiger, Georgie Thein; AEG, Flextronics International Inc. |
Abstract: |
The world of electronics continues to increase functional densities on products. One of the ways to increase density of a product is to utilize more of the 3 dimensional spaces available. Traditional printed circuit boards utilize the x/y plane and many miniaturization techniques apply to the x/y space savings, such as smaller components, finer pitches, and closer component to component distances. This paper will explore the evolution of 3D assembly techniques, starting from flexible circuit technology, cavity assembly, embedded technology, 3 dimensional surface mount assembly, etc.... |
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