Status and Outlooks of Flip Chip Technology
Published: |
November 14, 2018 |
Author: |
John H. Lau |
Abstract: |
Status of flip chip technology such as wafer bumping, package substrate, flip chip assembly, and underfill will be reviewed in this study. Emphasis is placed on the latest developments of these areas in the past few years. Their future trends will also be recommended. Finally, the competition on flip chip technology will be briefly mentioned.... |
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