High Frequency Dk and Df Test Methods Comparison High Density Packaging User Group (HDP) Project
Published: |
February 6, 2019 |
Author: |
Karl Sauter |
Abstract: |
The High Density Packaging (HDP) user group has completed a project to evaluate the majority of viable Dk (Dielectric Constant)/Df (Dissipation Factor) and delay/loss electrical test methods, with a focus on the methods used for speeds above 2 GHz. A comparison of test methods from 1 to 2 GHz through to higher test frequencies was desired, testing a variety of laminate materials (standard volume production with UL approval, low loss, and "halogen-free" laminate materials). Variations in the test board material resin content/construction and copper foil surface roughness/type were minimized. Problems with Dk/Df and loss test methods and discrepancies in results are identified, as well as possible correlations or relationships among these higher speed test methods.... |
You must be a registered user to talk back to us. |
Company Information:
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
High Frequency Dk and Df Test Methods Comparison High Density Packaging User Group (HDP) Project article has been viewed 574 times