Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum
Published: |
January 28, 2020 |
Author: |
Heller Industries |
Abstract: |
This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.... |
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