Electromechanical Reliability Testing of Flexible Hybrid Electronics Incorporating FleX Silicon-on-Polymer ICs
Published: |
August 18, 2021 |
Author: |
Darrell E. Leber, Brian N. Meek, Seth D. Leija, Dale G. Wilson, Richard L. Chaney, and Douglas R. Hackler |
Abstract: |
Flexible Hybrid Electronics combine the best characteristics of printed electronics and silicon ICs to create high performance, ultra-thin, physically flexible systems. New static and dynamic tests are being developed to evaluate the performance of these systems. Dynamic radius of curvature and torsional test results are presented for a flexible hybrid electronics system with a FleX Silicon-on-Polymer operational amplifier manufactured in an 180nm CMOS process with 4-levels of metal interconnect mounted on a PET substrate.... |
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