HDI Microvia Technology – Cost Aspects
Published: |
December 21, 2021 |
Author: |
Stefan Keller |
Abstract: |
Points of discussion in "HDI Microvia Technology – Cost Aspects" are: - Reasons for the use of HDI technology - Printed circuit board (PCB) size - Number of layers - Stack-up and complexity - Other important cost influences -–Design rules -–Drilling costs -–Microvia filling... |
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