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Additively Manufactured mm-Wave Multichip Modules With Fully Printed "Smart" Encapsulation Structures

Published:

February 9, 2022

Author:

Xuanke He, Bijan K. Tehrani, Ryan Bahr, Wenjing Su, and Manos M. Tentzeris

Abstract:

This article presents the first time that an millimeter-wave (mm-wave) multichip module (MCM) with on-demand "smart" encapsulation has been fabricated utilizing additive manufacturing technologies. RF and dc interconnects were fabricated using inkjet printing, while the encapsulation was realized using 3-D printing. Inkjet-printed interconnects feature superior RF performance, better mechanical reliability, and on-demand, low-cost fabrication process....

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Company Information:

Center for Board Assembly Research CBAR- advanced research on board assembly processes and systems

Atlanta, Georgia, USA

Research Institute / Laboratory / School

  • Phone 404-385-1053

See Company Website »

Company Postings:

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