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Considerations for Minimizing Radiation Doses to Components during X-ray Inspection

Published:

February 21, 2022

Author:

David Bernard, Richard C. Blish, II

Abstract:

The ability to undertake non-destructive testing on semiconductor devices, during both their manufacture and their subsequent use in printed circuit boards (PCBs), has become ever more important for checking product quality without compromising productivity. The use of x-ray inspection not only provides a potentially non-destructive test but also allows investigation within optically hidden areas, such as the wire bonding within packages and the quality of post solder reflow of area array devices (e.g. BGAs, CSPs and flip chips)....

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Company Information:

The leading provider of award winning bond testing equipment and continues to invest significantly in research and development to remain at the cutting edge of bond tester technology.

Aylesbury. Buckinghamshire, United Kingdom

Consultant / Service Provider, Manufacturer

  • Phone +44 (0) 1296 317800
  • Fax +44 (0) 1296 317801

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Company Postings:

(11) products in the catalog

(3) technical library articles

(141) news releases

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