Selective Solder Paste Deposition Reliability Test Results.
Published: |
June 21, 2007 |
Author: |
Bob Wettermann. |
Abstract: |
The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture (...) While there have been several studies comparing these two attachment methods, this study highlights the effect of rework technique on the electrical characteristics and reliability of reworked BGAs.... |
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