Micro-Sectioning of PCBs for Failure Analysis
Published: |
January 13, 2010 |
Author: |
Bob Wettermann |
Abstract: |
Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package. Destructive in nature, cross-sectioning requires encapsulation of the specimen in order to provide support, stability, and protection. Failures that can be investigated through micro-sectional analysis include component defects, thermo-mechanical failures, processing failures related to solder reflow, opens or shorts, voiding and raw material evaluations.... |
|
|
|
|
|
|
You must be a Company Information:
More articles from BEST Inc. »
- May 29, 2019 - Hand Printing using Nanocoated and other High End Stencil Materials
- Mar 30, 2017 - Solder Paste for BGA Rework | Multiple Methods for Applying Paste Flux
- Feb 01, 2017 - BGA Rework Process
- Oct 06, 2016 - PCB Laser Depanelizing Using a UV Laser
- Aug 27, 2015 - Adhesive Backed Plastic Stencils vs Mini Metal Stencils
- See all SMT / PCB technical articles from BEST Inc. »
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
Micro-Sectioning of PCBs for Failure Analysis article has been viewed 591 times
