Understanding the Effect of Process Changes and Flux Chemistry on Mid-Chip Solder Balling
Published: |
November 30, 2016 |
Author: |
Katherine Wilkerson, Ian J. Wilding, Michael Carter, Daniel Buckland |
Abstract: |
Mid-chip solder balling is a defect typically associated with solder paste exhibiting poor hot slump and/or insufficient wetting during the reflow soldering process, resulting in paste flowing under the component or onto the solder resist. Once molten, this solder is compressed and forced to the side of the component, causing mid-chip solder balling. This paper documents the experimental work performed to further understand the impact on mid-chip solder balling from both the manufacturing process and the flux chemistry.... |
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