Printable Nanocomposites for Electronic Packaging

Published:

June 25, 2008

Author:

Endicott Interconnect Technologies, Inc.

Abstract:

Printing technologies provide a simple solution to build electronic circuits on o low cost flexible substrates. Nanocomposites will play important role for developing advanced printable technology. Advanced printing is relatively new technology and need more characterization and optimization for practical applications. In the present paper, we examine the use of nanocomposites or materials in the area of printing technology....

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Company Information:

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, USA

Manufacturer

  • Phone 866 820-4820
  • Fax 607 755-7000

See Company Website »

Company Postings:

(3) products in the catalog

(20) technical library articles

(26) news releases

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