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An Experimental and Computational Study of the Current Carrying Capacity of High Performance PWB Interconnections

Published:

January 1, 2009

Author:

Michael J. Rowlands and Vara Calmidi, Endicott Interconnect Technologiesogies

Abstract:

Recent technology advancement has enabled enhancement in PWB electrical performance and wiring density. These innovations have taken the form of improved materials, novel PWB interconnect structures, and manufacturing technology. One such advancement is Z-axis conductive interconnect. The Z-interconnect technology involves building mini-substrates of 2 or 3 layers each, then assembling several mini-substrates together using conductive paste....

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Company Information:

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, USA

Manufacturer

  • Phone 866 820-4820
  • Fax 607 755-7000

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Company Postings:

(3) products in the catalog

(20) technical library articles

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