• SMTnet
  • »
  • Technical Library
  • »
  • Joule Heating Effects on the Current Carrying Capacity of an Organic Substrate for Flip-Chip Applications

Joule Heating Effects on the Current Carrying Capacity of an Organic Substrate for Flip-Chip Applications

Published:

July 22, 2009

Author:

Varaprasad Calmidi, Irv Memis.

Abstract:

This paper deals with the thermal effects of joule heating in a high interconnect density, thin core, buildup, organic flip chip substrate. The 440 μm thick substrate consists of a 135 μm thick core with via density of about 200 μm. The typical feature sizes in the substrate are 50 micron diameter vias is the core/buildup layers and 12 micron thick metal planes. An experimental test vehicle is powered with current and the temperature rise was measured. A numerical model was used to simulate the temperature rise in the TV....

  • Download Joule Heating Effects on the Current Carrying Capacity of an Organic Substrate for Flip-Chip Applications article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 

Company Information:

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, USA

Manufacturer

  • Phone 866 820-4820
  • Fax 607 755-7000

See Company Website »

Company Postings:

(3) products in the catalog

(20) technical library articles

(26) news releases

  • Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
  • Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
  • Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
  • Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
  • Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
  • Browse Technical Library »

Joule Heating Effects on the Current Carrying Capacity of an Organic Substrate for Flip-Chip Applications article has been viewed 526 times

  • SMTnet
  • »
  • Technical Library
  • »
  • Joule Heating Effects on the Current Carrying Capacity of an Organic Substrate for Flip-Chip Applications
Global manufacturing solutions provider

SMT Machines china