Nanofluids, Nanogels and Nanopastes for Electronic Packaging

Published:

December 22, 2010

Author:

Rabindra N. Das, Varaprasad Calmidi, Mark D. Poliks and Voya R. Markovich

Abstract:

This paper discusses polymer based nanogels, nanofluids and nanopastes for thermal interface material (TIM) applications. Nanopaste and nanogel formulated using controlled-sized particles to fill small bond lines is highlighted....

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A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

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