SEHO MWM 3250 Selective Soldering machine

  High precision SCARA robot

-  Maximum flexibility with

   different working stations

   which may be arranged in the

   process area according to

   your requirements

-  Short product change-over

   times

-  Gripper with directional

   functions for non-planar PCBs

-  State-of-the-art solder nozzle

   technology

-  Permanent wave height

   control

-  Easy and quick online

   programming

-  Comfortable offline teach

   program for maximum

   machine availability 

The MWM 3250 is a modular selective SOLDERING system which may be totally tailored to meet your production requirements. At a later date it may even be upgraded to suit subsequent production developments.

The MWM 3250 is suitable to meet all requirements: productions with a high mix of assemblies typically use the miniwave SOLDERING process. High volume productions with only low board mix prefer a dip SOLDERING process with product specific multi nozzle tools to shorten cycle times.

If frequently changing products are manufactured in high production volumes, the MWM 3250 may be equipped with various SOLDERING units to cover different SOLDERING processes with only one machine system. Also conventional wave SOLDERING processes may be performed this way.

With its positioning accuracy of 0.05 mm, the robot – which guides the gripper - offers a maximum precision. Depending upon requirement different grippers for the processing of carriers or PCBs directly may be used.

The state-of-the-art solder nozzle technology effects the highest degree of precision. The solder nozzles perform a defined flow direction. These non-wettable, of course lead-free capable solder nozzles therefore show a reproducible flow behaviour and thus guarantee consistently good SOLDERING results. With minimum maintenance requirements, these SOLDERING nozzles are featured with a very high lifetime.