DEK automatic solder paste printing machine
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DEK automatic solder paste printing machine |
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China |
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| Contact KingFei SMT Tech |
DEK 03IX automatic solder paste printing machine features advanced up/down k-view vision system, independent control and adjustment of lighting, high-speed moving lens, accurate alignment of PCB PCB and net board. The DEK Horizon 03IX automatic solder paste printing machine ensures a printing accuracy of ±25 microns and 6 sigma. High precision servo motor drive and PC control, ensure the stability and precision of printing, as well as image pattern recognition and repeated positioning accuracy. Cantilever printing head, with special design of high rigidity structure, scraper pressure, speed, stroke are controlled by computer servo, to maintain uniform and stable printing quality; The scraper beam is specially optimized with light weight and beautiful appearance.
DEK03IX automatic solder paste printing machine automatic, unassisted net bottom cleaning function, programmable control of dry, wet or vacuum cleaning, cleaning time can be freely selected, DEK03IX automatic solder paste printing machine completely remove the residual solder paste in the mesh, ensure the printing quality.
The multi-function plate handling device can automatically position and clamp PCB of all sizes and thicknesses. With removable magnetic thimble and edge clamp device, it can effectively overcome the deformation of the plate and ensure a uniform printing process. Dek Horizon 03IX automatic Screw Paint Printing Machine has the operation interface and rich software functions. It has a good man-machine communication environment, simple operation, convenient, easy to learn and use. It has the function of self-diagnosing sound and light alarm and reminding the cause of failure. Both single/double-sided PCB printed circuit board can be operated.
DEK Horizon 03IX Automatic Printing Press
DEK03IX automatic solder paste printing machine equipment technical specifications
describe
specifications
Equipment alignment accuracy
> 2CPK @ +/- 12.5 microns, 6 sigma
Process alignment accuracy
> 2CPK @ +/- 25 microns, 6 sigma
Core printing cycle time
12 seconds (up to 11 seconds with HTC)
Mechanical system for scraper pressure
Software controlled, motor driven
ISCANTM device control
Operational control using CAN BUS networks
interface
Color flat-screen touch screen, keyboard and trackball, Dek CaptivTM V9 user interface
Screen orientation
Manually load using a mesh frame depth adjuster
Maximum substrate handling size
510 mm (X) X 508.5 mm (Y)
Minimum substrate handling size
50 mm (X) X 40.5 mm (Y)
The thickness of the substrate
0.2 to 6 millimeters
Base board weight 1 kg
Rail type Use 3 mm round belt integrated transmission system
The visual system
Cognex
Camera lighting
Software controlled programmable LED lighting
DEK03IX solder paste press size weight:
Transportation information
specifications
About the weight
790kg after packing (depending on randomly purchased option)
630 kg naked machine (depending on randomly purchased option)
About the size
2060 mm x1500 mm x1550 mm
Company Information:
