Test Research (TRI) TRI TR7700SIII Plus 2D In-line Automated Optical Inspection PCB AOI MACHINE

Product description:
Optical System
Imaging Method Dynamic Imaging
Top Camera 4 Mpix
Angle Camera N/A
Imaging Resolution 10 µm, 15 µm (factory setting)
Lighting Multi-phase RGB+W LED
3D Technology Single/Dual 3D laser sensors (optional)
Max. 3D Range 20 mm (with 3D Laser Sensor upgrade optional)
Inspection Performance
Imaging Speed 4 Mpix@ 10 µm 2D: 60 cm²/sec
4 Mpix@ 15 µm 2D: 120 cm²/sec
4 Mpix@ 10 µm 2D+3D (optional): 27-39 cm²/sec
4 Mpix@ 15 µm 2D+3D (optional): 40-60 cm²/sec

Note: Depending on board size and laser resolution
Motion Table & Control
X-Axis Control Ballscrew + AC-servo controller
Y-Axis Control Ballscrew + AC-servo controller
Z-Axis Control N/A
X-Y Axis Resolution 1 µm
Board Handling
Max PCB Size TR7700 SIII Plus: 510 x 460 mm
TR7700L SIII: 660 x 610 mm
TR7700 SIII DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
PCB Thickness 0.6-5 mm
Max PCB Weight TR7700 SIII Plus: 3 kg
TR7700L SIII: 5 kg
TR7700 SIII DL: 3 kg
Top Clearance 25 mm [48 mm optional]
Bottom Clearance 40 mm
Edge Clearance TR7700 SIII Plus: 3 mm [5 mm optional]
TR7700L SIII: 5 mm
TR7700 SIII DL: 3 mm [5 mm optional]
Conveyor Inline
Height: 880 – 920 mm

* SMEMA Compatible
Inspection Functions
Component Missing
Tombstoning
Billboarding
Polarity
Rotation
Shift
Wrong Marking (OCV)
Defective
Upside Down
Extra Component
Foreign Material
Solder Excess Solder
Insufficient Solder
Bridging
Through-hole Pins
Lifted Lead
Golden Finger
Scratch/Contamination
Dimensions
WxDxH TR7700 SIII Plus: 1100 x 1670 x 1550 mm
TR7700L SIII: 1300 x 1635 x 1655 mm
TR7700 SIII DL: 1100 x 1670 x 1550 mm

Note: not including signal tower, signal tower height 520 mm
Weight TR7700 SIII Plus: 1080 kg
TR7700L SIII: 1240 kg
TR7700 SIII DL: 1150 kg