Agilent 5DX 5400 Series 3

Model:	Agilent 5DX 5400 Series 3
Category:	X-Ray Inspection
Model Year:	2000
Condition:	used
Location:	United Kingdom
Offered by:	Evolvi SMT
	Contact Supplier

Agilent 5DX 5400 Series 3 (2000) X-ray inline inspection

Complete and fully functional

Very Good condition

Available to view at our facility.

Very competitively priced

GeneralSpecifications: Agilent5DXSeries3ModelSpecifications
inspection, alignment, surface map, and board handling time).
Image Acquisition Time (including movement)
Up to 5 images per second
Load/Unload Time
12 seconds per panel for pass-through mode, 15 seconds for pass-back mode, 6 seconds per panel using dual loading
Alignment Time
3 to 8 seconds (depending on board size)
Surface Map Time (Points/Second)
Up to 5 points/sec (typical map density is 1 point / 645–2580 sq. mm (1–4 sq. inches)
Description
Field of View Joint Pitch
Top Clearance Bottom Clearance

Model 5400A
Ultra Fine Pitch
From 5. to 20.mm (0.2 to 0.8 in.)
0.2 mm† & up (0.008 in.† & up)
9.4 to 25.mm* (0.37 to 1.0 in.*)
30 mm*
(1.2 in.*)

* Measuredfromthebottomofthecircuitboardincludingamaximumwarpageof2mm(0.080in.)for5100A systems and 1.5mm (0.060 in.) for 5300A/5400A systems. If components at the maximum top clearance are used, slices cannot extend more than 0.5mm (0.020 in.) below the bottom surface of the board.
† Assumingpadwidthis50%ofpitch.
‡ 5300providesadditionalfov’sthatmayreduceprogrammingeffortrequiredtoefficientlyinspect20mil pitch components.

Board Specifications / Tolerances Software Features
Board Handling Size (width x length)
Menu Driven Interface
Operator-mode:
Used in normal Automatic Inspection mode. Operator inputs subpanel identification using bar-code or keyboard.
Supervisor-mode:
Allows complete control of the system which includes algo- rithm setup and debug, CAD data generation, and system diagnostics.
System Confirmation & Adjustment
The system automatically adjusts for the following:
• X-ray beam and rotary detector synchronization • X and Y homing position
• Z-homing position
• Gray-scale to solder thickness
• Plane of focus
Audit Mode
The Audit Mode provides the operators a review of an inspected board. The operator chooses from the following review parameters:
Max.:
Min.:
Aspect Ratio:
457 x 609 mm* (18.0 x 24.0 inches*) 102 x 127 mm† (4.0 x 5.0 inches†) Board length > = 0.5 x board width*
* Boardsarehandledonthewidthedges.
† Smallerboardsarepossiblewiththeuseofboardcarriers.
Maximum Test Area A
Standard (width x length) 356 x 597 mm (14.0 x 23.5 in.)
With expanded test area option (width x length) 445 x 597 mm (17.5 x 23.5 in.)
Board thickness A
Max.: 3.2 mm (0.125 in.) Min.: 0.5 mm (0.020 in.)
A Maximum and minimum board thickness limits can be exceeded with the use of board carriers.
Board Width Tolerance
± 0.7 mm (0.0275 in.)
Board Edge Clearance
3 mm (0.118 in.) on parallel edges of the board (top and bottom side clearance requirement)
Board Warpage (after reflow and wave soldering)
Normal board usage requires a warpage of less than 1%* of any linear dimension (0.01 inch/inch or 0.01 mm/mm), assuming that the overall board dimensions still fit within the board clearance and width specifications. Maximum board warpage cannot exceed 2 mm† (0.08 in.†).
Board warpage of 0.5% or less is required to maximize throughput for some device types.
* Boardswithlargerwarpagepercentagescanbeinspected, but will require additional surface map points and analysis views. Board must still fit general board clearance specifications.
† 1.5mm(0.06in.)fortheModel5300A/5400A.
Maximum Acceptable Board Weight (including board carrier)
4.5 Kg (10 lb.)
1 Kg (2.2 lb.) per panel with dual load option
Minimum Acceptable Board Weight
0.03 Kg (.066 lb.)
Maximum Acceptable Board Temperatures (at time of load)
40°C (104°F)