Feb 20, 2002
The NEPCON West conference will address issues on advanced packaging, test, substrates, business, reliability, manufacturing, soldering and materials, design, connectors and interconnection, continuous process improvement, e-manufacturing, emerging technologies and wireless. The FiberOptic Automation Expo conference will address issues on optoelectronic devices, modules and subassemblies, packages and packaging, optical fiber, materials, manufacturing processes, assembly, equipment, applications, and business and strategic considerations.
Members of the NEPCON West technical committee include Bala Balakrishnan, Cal State Poly Tech; James Blankenhorn, SMT Plus; Dr. Jean-Paul Clech, EPSI; Joe Fjelstad, Pacific Consultants LLC; Steve Greathouse, Intel Corp.; Dr. Jennie S. Hwang, H-Technologies Group; Kim Hyland, Solectron Corp.; Ralph Kenton, Ralph Kenton & Associates; Dr. Ning-Cheng Lee, Indium Corp. of America; Scott Penin, APW eMech Systems; Lee Ritchey, Speeding Edge; Suzanne Romeo, IICIT; Vern Solberg, Tessera; Bob Stasonis, Teradyne; Louis Ungar, A.T.E. Solutions; Jim Walker, Dataquest/Gartner Group; and Sammy Yi, Flextronics International USA.
Members of the FiberOptic Automation Expo technical conference include Peter Arrowsmith, Celestica; Joseph Campbell, Adept Technology; Matthew Doty, Silicon Bandwidth; Terry Hannon, Coherent Laser Division; Michael Jansen, Lucent Technologies; Bob Marrs, Kulicke & Soffa; Dan Nelson, JDS Uniphase; Gary Pangelina, SST International; Bryan Pate, Palomar Technologies; Alan Rae, Cookson Electronics; Richard Ross, RJR Polymers; Frank Shi, University of California; Dr. Ephraim Suhir, iolon; Dr. Ampere Tseng, Arizona State University; Dr. Laura Turbini, University of Toronto; Sri Venkat, Coherent Laser Division; and Glenn Woodhouse, Plexus.
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