News Releases from Association Connecting Electronics Industries (IPC)
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1300 news releases added by Association Connecting Electronics Industries (IPC)
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Vying for Top Spot at IPC Midwest Hand Soldering Competition 14 Competitors Ready to Bring It — Only a Few Open Slots Remain
Aug 08, 2012 | Bragging rights are on the line as the Second Annual IPC Midwest Soldering Competition takes place, August 22–23, in Schaumburg, Ill., to determine the Best Hand-Soldering Technician in the Midwest
Omron Demos High-Speed PCB Inspection Technology Solutions at the 2012 IPC Midwest Conference & Exhibition
Aug 03, 2012 | Omron Inspection Systems (www.omron247.com) will display and demo its latest concepts and enhancements in AOI systems at the 2012 IPC Midwest Conference & Exhibition
IPC Educational Outreach Clarifying ITAR Regulation of Printed Boards Headed to IPC Midwest
Aug 02, 2012 | On August 22, IPC and the Chicagoland Circuit Board Association (CCBA) will host a meeting at IPC Midwest Conference & Exhibition on IPC’s new educational campaign, Follow the Law, Protect the Board.
IPC RELEASES PCB INDUSTRY RESULTS FOR JUNE 2012
Jul 26, 2012 | IPC announced today the June findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
IPC to Launch Educational Campaign on ITAR and Printed Boards Washington, D.C. Meetings and IPC White Paper Kick Off Initiative to Raise Awareness
Jul 19, 2012 | On July 25, IPC will launch its new educational campaign, Follow the Law, Protect the Board, to raise awareness and compliance with federal regulations on the export of printed boards (PCBs) designed for International Traffic in Arms Regulations (ITAR) controlled equipment
IPC AND JPCA DEVELOP FIRST OPERATIONAL-LEVEL STANDARD FOR THE PRINTED ELECTRONICS INDUSTRY
Jul 17, 2012 | First Step in IPC’s Printed Electronics Initiative to Help Industry Grow
New IPC-1758 Data Exchange Standard on Pack and Packing Materials Provides Consistency, Efficiency and Integrity to Declaration Process
Jul 12, 2012 | — IPC — Association Connecting Electronics Industries® has released IPC-1758, Declaration Requirements for Shipping, Pack and Packing Materials.
IPC Midwest Set to Open with the Big News in Nanotechnology
Jul 11, 2012 | As electronics manufacturers strive to keep costs of high density electronics in check, the potential of nanotechnology and its growing applications make it an extremely attractive technology worth examining.
IPC ISSUES CALL FOR PARTICIPATION FOR LEAN SYMPOSIUM
Jul 04, 2012 | — IPC — Association Connecting Electronics Industries® invites experts to submit abstracts for the IPC Symposium on Lean for the Electronics Assembly Industry: Putting Theory to Practice.
IPC Midwest Stays Its Course to Bring Electronics Manufacturing Solutions and Opportunities to the Heart of the Midwest
Jul 02, 2012 | With more than 50 exhibitors and three-quarters of its show floor sold to date, IPC Midwest is geared up to deliver another very focused, regional event targeted solely to the electronics manufacturing industry.
IPC to Hold Inaugural Test and Inspection Online Symposium Case Studies, Technology Review Will be Presented
Jun 29, 2012 | Electronic product and manufacturing trends continue to challenge both users and providers of test and inspection technologies at all levels of the supply chain.
IPC RELEASES PCB INDUSTRY RESULTS FOR MAY 2012
Jun 27, 2012 | IPC — Association Connecting Electronics Industries® announced today the May findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
IPC RELEASES PCB INDUSTRY RESULTS FOR MAY 2012
Jun 27, 2012 | IPC — Association Connecting Electronics Industries® announced today the May findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
IPC APEX EXPO Named In Top 25 Fastest-Growing Trade Shows Sold Out Show Floor Predicted for 2013
Jun 23, 2012 | IPC – Association Connecting Electronics Industries® announces that IPC APEX EXPO® has been named one of the Trade Show News Network 2012 “Top 25 Fastest-growing Trade Shows in Attendance in the United States.”
EDWARD TRACKMAN JOINS IPC AS VICE PRESIDENT OF SPECIAL PROJECTS
Jun 19, 2012 | IPC — Association Connecting Electronics Industries® announces that Edward Trackman has joined the IPC staff as vice president of special projects.
Executives to Experience Electronics in the Fast Lane at IPC Midwest
Jun 15, 2012 | “Electronics in the Fast Lane: How High Speed Technologies are Changing the Game,” will be the theme of the IPC Executive Summit, August 21–22, 2012, in Schaumburg, Ill.
IPC Members Meet with EPA on Proposed Changes to DSW Rule Advocate for Rule that Encourages Recycling of Secondary Materials
Jun 13, 2012 | On Tuesday, June 5, 2012, leaders of IPC’s Environment, Health and Safety (EHS) Committee met with senior U.S. Environmental Protection Agency (EPA) staff to discuss regulatory relief for printed board manufacturing.
IPC Puts It to a Vote: Asks Who Will Be 2013 IPC APEX EXPO Keynoter? Deep Sea Explorer, Physicist, Movie Producer or Astrophysicist?
Jun 11, 2012 | Opening Keynote speaker is in the hands of the electronics manufacturing industry. IPC is asking industry to decide who would be the ideal keynote speaker to kick off three days of inspiring information and knowledge at IPC APEX EXPO 2013, February 19–21, in San Diego.
IPC Puts It to a Vote: Asks Who Will Be 2013 IPC APEX EXPO Keynoter? Deep Sea Explorer, Physicist, Movie Producer or Astrophysicist?
Jun 11, 2012 | Opening Keynote speaker is in the hands of the electronics manufacturing industry. IPC is asking industry to decide who would be the ideal keynote speaker to kick off three days of inspiring information and knowledge at IPC APEX EXPO 2013, February 19–21, in San Diego.
Reading the Fine-Pitch — IPC-7525 Updated to Deal with New Materials
Jun 09, 2012 | To help designers and board assemblers address the challenges of working with new materials and smaller, finer-pitch components, IPC – Association Connecting Electronics Industries® released the B revision of IPC-7525, Stencil Design Guidelines.
IPC Provides Input to U.S. House Oversight and Government Reform Committee
Jun 07, 2012 | Highlights Federal Regulations that Burden Electronics Manufacturers
IPC-4204A Provides Guidance on High Speeds and Fine Lines
Jun 01, 2012 | As chip speeds skyrocket and system sizes diminish, designers and manufacturers face new and complex challenges
IPC MIDWEST TECHNICAL CONFERENCE FOCUSES ON WORKING SMARTER TO INCREASE RELIABILITY AND MINIMIZE DEFECTS
May 30, 2012 | IPC Midwest Conference & Exhibition™ will highlight advances in assembly materials, assembly processes and reliability testing to help electronics companies address critical challenges in manufacturing defect-free, quality electronics
IPC RELEASES PCB INDUSTRY RESULTS FOR APRIL 2012
May 25, 2012 | IPC — Association Connecting Electronics Industries® announced today the April findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
IPC/JEDEC-9704A Takes the Stress Out of Strain Gage Testing
May 23, 2012 | Joint Industry Guideline Provides Best Practices for Measuring the Strain on Boards and Components During Manufacturing
IPC’s Second Annual IPC Midwest Hand Soldering Competition Looks to Crown New Champ Who Will Earn the Coveted Title of Best-of-the-Best in the Midwest?
May 18, 2012 | IPC Midwest Conference & Exhibition. Participants will compete against each other to build a functional electronics assembly within a half-hour time limit to ultimately determine who the best-of-the-best is in the Midwest.
IPC RELEASES STUDY ON QUALITY BENCHMARKS FOR EMS INDUSTRY
May 15, 2012 | IPC annual study provides data to EMS companies interested in comparing their key 2011 operating variables to those of other EMS providers by type of product.
IPC Midwest Spotlights New Resources and Solutions to Reliability Challenges in Electronics Manufacturing Registration Now Open
May 15, 2012 | IPC Midwest will highlight the new technologies, materials and processes in electronics manufacturing to help engineers solve their challenges and work smarter.
IPC Board Chairman Steve Pudles Testifies Before Congress Urges Changes to SEC Proposed Rule on Conflict Minerals
May 10, 2012 | IPC is advocating changes to the draft SEC rule implementing Section 1502 of the Dodd-Frank Act that would lessen the burden on small manufacturing companies
IPC Board Chairman Steve Pudles Testifies Before Congress Urges Changes to SEC Proposed Rule on Conflict Minerals
May 10, 2012 | IPC is advocating changes to the draft SEC rule implementing Section 1502 of the Dodd-Frank Act that would lessen the burden on small manufacturing companies
New IPC Survey to Measure Impact of On-Shoring in the Electronics Industry Electronics manufacturers and suppliers encouraged to participate
May 04, 2012 | IPC – Association Connecting Electronics Industries® launched a survey today to measure the impact of a phenomenon known as “on-shoring” — the migration of manufacturing operations back to the Americas from overseas, in the electronics industry.
Updates in IPC-6018B Help Engineers Design High-reliability Boards Specification addresses growing field of microwave technology
May 04, 2012 | As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.
New IPC President and CEO Begins Tenure with Promise to Accelerate Services to Support Membership
May 01, 2012 | New IPC President and CEO John Mitchell started his first week on the job at the association that, 55 years ago, helped a newly formed printed wiring board industry gain acceptance, strength and visibility
IPC-9203 Makes it Easier for Users to Determine Materials Compatibility
Apr 30, 2012 | The job of testing or demonstrating materials and process compatibility just became easier with the newly released IPC-9203,
Space Selection for IPC APEX EXPO 2013 Set to Bloom in May Contracted Square Footage for 2013 Already Up 11 Percent
Apr 27, 2012 | Following showers of praise at IPC APEX EXPO® 2012, the number of exhibitor contracts for the 2013 event is nearing double-digit growth over the same time last year. On May 22, IPC will begin the space selection process for the 2013 show in San Diego.
IPC TECHNOLOGY TRENDS STUDY REVEALS CHANGES IN STORE FOR PCB FABRICATORS AND SUPPLIERS
Apr 27, 2012 | PCB Technology Trends 2011, a new study published this week by IPC — Association Connecting Electronics Industries®, shows how the demands of miniaturization and high-speed technology are driving changes in printed circuit board (PCB) processes and materials.
IPC Releases PCB Industry Results For March 2012
Apr 27, 2012 | IPC announced today the March findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
IPC CONFERENCE EXPLORES POTENTIAL OF FLEXIBLE CIRCUIT TECHNOLOGY
Apr 12, 2012 | Flexible circuit technology is utilized in all market sectors, including military, telecommunications, medical and consumer products.
IPC and ECIA to Work on Component Obsolesce Guideline
Apr 06, 2012 | When a component manufacturer discontinues a particular component, it creates a ripple effect throughout the electronics assembly industry, leaving EMS providers with myriad critical questions to answer.
IPC CONFERENCE IN BUDAPEST BOOMS WITH DOUBLE-DIGIT GROWTH
Apr 05, 2012 | IPC's second annual Conference on Electronics Assembly: Soldering, Assembly & Inspection, held in Budapest, Hungary last month saw an increase of 21 percent in attendees and a 44 percent increase in exhibitors over its inaugural event last year.
IPC ISSUES CALL FOR PARTICIPATION FOR 2013 IPC APEX EXPO
Apr 03, 2012 | — IPC — Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders to submit abstracts for the 2013 IPC APEX EXPO® at the San Diego Convention Center in San Diego, Calif.
IPC-A-610E Japanese Language Released: Industry Requirements for Acceptability of Electronic Assemblies Updated
Apr 03, 2012 |
BANNOCKBURN, Ill., USA, April 3, 2012 — IPC — Association Connecting Electronics Industries® announced the Japanese language release of the E revision of IPC-A-610, 電子組立品の許容基準. IPC’s most widely-used standard.
IPC RELEASES PCB INDUSTRY RESULTS FOR FEBRUARY 2012
Mar 30, 2012 | — IPC — Association Connecting Electronics Industries® announced today the February findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
IPC Announces Spring 2012 Webinar Series Tin Whiskers, PoP Cleaning, PCB Prototyping and Business Outlook to be Covered
Mar 29, 2012 | Providing convenient and cost-effective staff development, IPC announces its 2012 spring webinars for April, May and June. Each one-hour webinar is focused on technical challenges facing the electronics manufacturing industry, offering companies a great opportunity to bring IPC technical information to a large number of employees at one time.
IPC Names John W. Mitchell as New President and CEO
Mar 28, 2012 | IPC announces the appointment of John W. Mitchell as its new president and CEO,
New Tutorial Released With IPC-2223C Provides Expert Advice and Tips for Designers Working With Flexible Circuits
Mar 28, 2012 | he industry standard that establishes the specific requirements for the design of flexible and rigid –flexible printed boards, IPC-2223, Sectional Design Standard for Flexible Printed Boards, has been recently updated to its C revision.
LEADING EXPERTS TAKE TIN WHISKERS FROM THEORY TO PRACTICE AT IPC CONFERENCE Are we understating the use of tin whisker risk mitigation methodologies?
Mar 26, 2012 | Tin whisker growth, risk mitigation, detection and failure analysis will be the focus of the IPC Tin Whiskers Conference, April 17–19, 2012, in Ft. Worth, Texas.
IPC INTERNATIONAL TECHNOLOGY ROADMAP PROVIDES OEM VISION OF FUTURE BOARDS AND ASSEMBLIES 2013 Roadmap Activities Get Underway with a Call for Volunteers
Mar 22, 2012 | The long-awaited 2011 IPC International Technology Roadmap for Electronic Interconnections was released last month at IPC APEX EXPO® 2012. Published biennially, the IPC Roadmap serves as an authoritative guide to interconnect technological trends, providing a vision of imminent, innovative technology.
Newly Updated IPC-AJ-820A Provides Nitty-Gritty of Electronics Assembly and Soldering
Mar 21, 2012 | For many designers and manufacturing personnel in the electronics manufacturing supply chain, IPC-AJ-820, Assembly and Joining Handbook, is the document of choice for all aspects involved in creating a PCB.
IPC Issues Call for Participation for IPC Midwest Conference & Exhibition
Mar 09, 2012 | IPC has issued a Call for Participation for the technical conference at IPC Midwest Conference & Exhibition™. The one show in the Midwest focused on printed boards and electronics manufacturing, this year’s event will take place August 22–23, 2012, at the Renaissance Schaumburg Convention Center in Schaumburg, Ill. Researchers, academics, technical experts and industry leaders are invited to submit abstracts on the materials and processes that contribute to the performance of printed board assemblies.
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