News Releases from Association Connecting Electronics Industries (IPC)
Read Association Connecting Electronics Industries (IPC) company news
- SMTnet
- »
- News
- »
- News Contributors
- »
- News Releases from Association Connecting Electronics Industries (IPC)
1300 news releases added by Association Connecting Electronics Industries (IPC)
Company Information:
IPC Market Data Update Shows Leading Indicators Offering Hope for U.S. Recovery
Mar 08, 2012 | Although global economic growth and electronics industry growth slowed in the fourth quarter of 2011, signs that the recovery is resuming in the USA is apparent, according to IPC’s quarterly report, Market Data Update, published last week. This winter 2012 edition reports the latest global and regional developments in the economy and the electronics industry, including selected findings from IPC's industry statistical programs and leading indicators.
IPC elects new officers and members to Board of Directors
Mar 07, 2012 | The Nominating and Governance Committee of the IPC Board of Directors presented nine candidates for election at the IPC Annual Meeting on Tuesday, February 28, 2012, in conjunction with IPC APEX EXPO® at the San Diego Convention Center. Three candidates were elected as board officers and will serve two-year terms beginning February 2012. Six candidates were elected as board directors and will serve four-year terms beginning February 2012.
IPC APEX EXPO Surges In San Diego
Mar 07, 2012 | The electronic interconnect industry came together at IPC APEX EXPO® last week in San Diego, with the show reporting a 26 percent increase in attendance over 2011 with 4,915 conference and exhibit hall attendees. IPC reported that 407 exhibitors participated in the event, resulting in 8,963 total visitors.
IPC Honors DDi Corp. and Flextronics with Corporate Recognition Awards
Mar 07, 2012 | IPC bestowed its highest corporate honors to DDi Corp. and Flextronics. During luncheons held in conjunction with IPC APEX EXPO®, IPC awarded the IPC Peter Sarmanian Corporate Recognition Award to DDi Corp. and the IPC Stan Plzak Corporate Recognition Award to Flextronics. For many years, both DDi Corp. and Flextronics have consistently provided staff resources to standards development and other committee initiatives.
Douglas Pauls Elected to Chair IPC's Top Standards Development Leadership Committee
Mar 07, 2012 | IPC announces the election of Douglas Pauls, principal materials and process engineer, Rockwell Collins, to chair the IPC Technical Activities Executive Committee (TAEC) for a two-year term. Elected to the position by the chairs and co-chairs of all IPC standards groups, Pauls succeeds Mel Parrish of STI Electronics, Inc. who held the role for IPC’s top standards development oversight committee for the past two years.
From the Wild West to the IPC Hall of Fame
Feb 28, 2012 | Since the "wild west" days of a relatively young printed circuit board industry when rules and infrastructure were not yet well established, Dennis “Denny” Fritz has been actively involved in IPC activities to help add structure, strength and vision to the industry. Today, he was honored with the IPC Raymond E. Pritchard Hall of Fame Award for his dedication and service to IPC and the industry. Presented at IPC APEX EXPO® in San Diego, the Hall of Fame Award represents IPC's highest level of volunteer recognition.
IPC Releases PCB Industry Results for January 2012
Feb 28, 2012 | IPC announced today the January findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
Volunteers Honored for Contributions to Electronics Manufacturing Industry and IPC
Feb 28, 2012 | IPC presented Presidents, Special Recognition, Distinguished Committee Leadership and Committee Service Awards at IPC APEX EXPO® at the San Diego Convention Center.
World’s Premier Electronics Manufacturing Technical Conference Selects Best International and U.S. Papers Papers to be Presented at IPC APEX EXPO 2012
Feb 23, 2012 | IPC has announced the winners of the Best U.S. and International Papers of IPC APEX EXPO® 2012. Selected through a ballot process by the event’s Technical Program Committee, the papers will be presented at IPC APEX EXPO, February 28–March 1, at the San Diego Convention Center.
IPC APEX EXPO Keynote Panel Forecasts Game Changers in the Industry
Feb 16, 2012 | What will have the greatest impact on the electronics industry in five years? Will it be technology, manufacturing, government regulations or global competition? The Wednesday Keynote at IPC APEX EXPO® 2012, February 28-March 1 at the San Diego Convention Center, will feature five panelists who will provide their unique perspectives on what the game changers will be for the industry.
Free Technical Programs and Activities at IPC APEX EXPO Provide Solutions to Critical Industry Challenges
Feb 10, 2012 | Renowned for the industry’s premier technical conference and courses, IPC APEX EXPO® also includes ample opportunities to learn about industry issues and find solutions free of charge. Exhibits-only registration to IPC APEX EXPO is free to individuals who register in advance and includes access to: inspiring and informative keynote sessions; BUZZ sessions covering key industry topics; the NPL Process Defect Clinic; free special events; and the largest exhibition in North America for printed board design and manufacturing, electronics assembly and test.
IPC Testifies Before U.S. House Committee On Foreign Affairs
Feb 10, 2012 | Representing IPC, Mikel Williams, president and CEO of DDi Corp. and chairman of the IPC Government Relations Committee, testified on February 7 before the U.S. House of Representatives Committee on Foreign Affairs to underscore the importance of clear and appropriate U.S. export controls on printed circuit board (PCB) designs for sensitive military technologies. The Committee on Foreign Affairs held the hearing to consider industry perspectives on export control reform, including proposals now being contemplated by the U.S. Departments of State and Commerce.
Printed Electronics Coming of Age at IPC APEX EXPO 2012
Feb 07, 2012 | A key enabling technology that is making a significant impact in consumer, commercial, medical and specialty electronics markets, printed electronics is coming of age at IPC APEX EXPO®, February 28-March 1, 2012, at the San Diego Convention Center. IPC APEX EXPO will feature a dedicated printed electronics area on the show floor, a printed electronics track in the technical conference, and historic standards development meetings where the first-ever industry requirements for the manufacture and assembly of printed electronics will be discussed and developed.
Non-IC Electronic Components Covered in Latest Update of JEDEC and IPC Quality and Reliability Standard for SMDs
Feb 07, 2012 | IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.
IPC Releases PCB Industry Results for December 2011
Feb 07, 2012 | IPC announced the December findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
IPC APEX EXPO Exhibitors to Feature More than 250 New Products Next Month
Jan 30, 2012 | Representing advances in more than 100 product categories within the electronics manufacturing supply chain, more than 250 new products and services will debut at IPC APEX EXPO®, February 28-March 1, 2012, at the San Diego Convention Center. New products will be introduced by over a quarter of the more than 400 exhibitors - a fitting testament to the event’s theme, Information that Inspires Innovation.
IPC EMS Wage Rate and Salary Study Shows Cautious Upturn in Salary Increases
Jan 30, 2012 | IPC’s recently published biennial wage and salary survey for the EMS industry shows a cautious upturn in salary increases in 2011, compared to 2009. Reporting on data from 151 U.S. and Canadian EMS facilities, IPC Wage Rate & Salary Study for the North American EMS Industry 2010-2011 is a valuable tool for EMS companies to gauge their position in competing for the best talent in the industry.
Series of IPC Data Exchange Standards Expands to Aid Companies with Environmental Compliance: Focus on Batteries and Lab Reports
Jan 24, 2012 | With the proliferation of regulations focused on materials in products, IPC is expanding its series of data exchange standards to meet the industry’s growing compliance needs. Newly formed, the IPC 2-18g Declaration of Batteries and Battery Materials and the IPC 2-18j Declaration of Chemical Analysis Lab Reports Task Groups will begin development of standards that aid in the exchange of information on batteries and lab reports, respectively. Companies throughout the electronics manufacturing supply chain are invited to attend these committees’ meetings at IPC APEX EXPO 2012, February 28-March 1, in San Diego.
Poll Finds Solder Finish, BGA Components and Reflow Soldering Most Challenging for Industry Engineers
Jan 22, 2012 | More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.
IPC APEX EXPO Ramps Up Preparations for Pending Regulation on Conflict Minerals
Jan 22, 2012 | To assist the industry in understanding the conflict minerals legislation set forth in Section 1502 of the Dodd-Frank Act and, more importantly, preparing to comply with the pending regulation, IPC APEX EXPO® will offer updates for the electronics manufacturing supply chain. Executive-level briefings, expert-panel discussions of new developments and industry compliance strategies, development of industry guidance documents and standards as well as an update on IPC’s continued lobbying efforts are designed to help industry companies fully comprehend the impact of the conflict minerals requirements.
IPC Comments on Proposed State Changes to Export Control
Jan 13, 2012 | IPC has filed comments with the U.S. Department of State’s Directorate of Defense Trade Controls (DDTC) urging them to protect the security of U.S. defense equipment by ensuring export control protection of design information for printed circuit boards for defense equipment. IPC strongly recommended that DDTC make clear that International Traffic in Arms Regulations (ITAR) apply to any printed board designs for defense items on the United States Munitions List (USML).
Executive Management Meetings at IPC APEX EXPO Spotlight Key Opportunities, Environmental Issues and International Trends
Jan 13, 2012 | Before the action begins at IPC APEX EXPO 2012, executives will gather for the IPC EMS Management Council Meeting and the IPC PCB Executive Management Meeting. These exclusive events, taking place February 27 at the San Diego Convention Center, will focus on the strategic business issues unique to senior-level decision makers in the PCB and EMS industries.
IPC Seeks Industry Comments on Draft of IPC-8701 Visual Acceptance Criteria for Solar Panels – Final Module Assembly
Jan 10, 2012 | Following two years in development, a draft of the industry’s first standard on the assembly of solar panels, IPC-8701, Visual Acceptance Criteria for Solar Panels - Final Module Assembly, was released today for industry review and comment. IPC - Association Connecting Electronics Industries® is seeking industry comments through February 9, 2012.
IPC INTERNATIONAL ACADEMIC COMPETITION WINNERS TO PRESENT RESEARCH AT IPC APEX EXPO 2012
Jan 10, 2012 | IPC announced the winning research papers selected in the 2012 IPC International Academic Paper Competition.
IPC Membership Reaches Record Number
Jan 07, 2012 | IPC ended the year 2011 with 3,215 members, the greatest number of members ever achieved in the organization’s history. Members are companies from every level of the electronics supply chain: printed board manufacturers, electronics manufacturing services companies, original equipment manufacturers and industry suppliers. Geographically, two-thirds of members are located in North America, while others are spread evenly between Europe and Asia.
IPC Releases IPC-9850A, Surface Mount Placement Characterization
Jan 07, 2012 | As EMS companies have ramped up speeds to meet the high demand for electronics, equipment manufacturers have responded by developing machines that quickly shift from handling one package style to another with fewer sacrifices in precision. To help industry determine the best equipment setup to meet needs for speed, capability and accuracy, IPC has released revision A to IPC-9850, Surface Mount Placement Characterization, making it far simpler to quantify the performance of placement equipment.
IPC Conference on Electronics Assembly in Budapest Offers Critical Information for Eastern Europe’s Fast-Growing Industry
Jan 07, 2012 | To support the consistent and rapid growth in Eastern Europe’s electronics assembly industry, IPC will hold its second annual IPC Conference on Electronics Assembly: Soldering, Assembly & Inspection in Budapest, Hungary, on 20-22 March 2012. This three-day event includes workshops, a two-day technical conference and a tabletop exhibition, providing myriad opportunities for participants to network with industry experts and gain insight into new technologies and trends in this key market.
IPC Releases PCB Industry Results for November 2011
Jan 03, 2012 | IPC announced the November findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
IPC Announces Winter 2012 Webinar Schedule
Dec 21, 2011 | Offering convenient and cost-effective staff development, IPC announces its Winter Webinar Series for January, February and March 2012. The one-hour webinars which focus on critical issues facing the industry, offer companies an opportunity to bring IPC technical information to a large number of employees at one time.
Advances in Lead-Free Alloys, Reliability, Halogen-Free and Counterfeit Components Highlight IPC APEX EXPO 2012 Technical Conference
Dec 14, 2011 | Featuring new research and innovations in printed board design and manufacturing, electronics assembly and test, the IPC APEX EXPO® technical conference will be held at the San Diego Convention Center, February 28-March 1, 2012.
How Much Strain Can a Package Take?
Dec 14, 2011 | Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
IPC Expands Communications Industry-Wide with Introduction of New E-Publication IPC Outlook
Dec 14, 2011 | In January 2012, IPC will launch IPC Outlook, an electronic newsletter and Web portal for multimedia information about technology, standards, best practices and industry research. The new e-publication will focus on information that helps engineers and managers succeed in their jobs.
Design Innovations and Best Practices at IPC APEX EXPO 2012
Dec 07, 2011 | Innovations and best practices will be featured in the IPC Designers Forum and design-focused courses at IPC APEX EXPO 2012, February 26-March 1, at the San Diego Convention Center.
IPC Rolls Out New Printed Electronics Management Council Committee
Dec 07, 2011 | IPC announces the creation of a new IPC Printed Electronics Management Council Steering Committee that will oversee the development of educational programs to support the printed electronics industry.
Industry's Most Baffling Defects No Match For Free Process Defect Clinic At IPC Apex Expo 2012
Dec 02, 2011 | Manufacturing and quality engineers looking for solutions to process challenges will find answers at the NPL Process Defect Database Clinic at IPC APEX EXPO®, February 28-March 1, 2012, at the San Diego Convention Center. Organized by IPC and the National Physical Laboratory (NPL), the free clinic will be held in the exhibit hall to assist event attendees with assembly and soldering process problems, RoHS compliance issues, solderability concerns, field failures and other process-related issues.
IPC Releases PCB Industryh Results For October 2011
Dec 01, 2011 | IPC announced the October findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
Industry Challenges Get Priority Attention from IPC APEX EXPO Professional Development Course Instructors
Nov 30, 2011 | Genuine electronics manufacturing industry concerns, challenges and problems will be addressed in 50 IPC APEX EXPO professional development courses, February 26–27 and March 1, 2012, at the San Diego Convention Center.
Breaking Down Language Barriers: IPC-T-50J Now Available
Nov 11, 2011 | Want to get a handle on commonly used electronics industry acronyms and terminology? Look no further than the definitive resource, IPC-T-50J, Terms and Definitions for Interconnecting and Packaging Electronic Circuits. Recently released by IPC, the J revision of IPC-T-50 contains nearly 400 new or revised terms, including terminology for chip scale and area array packaging, cable and wire harness technology, semiconductor packaging, assembly processing, moisture sensitive components and microvia technology.
IPC APEX EXPO Tackles Buzz-worthy Industry Issues in Free Sessions
Nov 03, 2011 | They are the subjects of countless headlines and industry tweets - the impact on industry of conflict minerals, embedded technology, process defects and supply line issues such as counterfeit parts - and the topics of two full days’ worth of free BUZZ sessions at IPC APEX EXPO® 2012.
New EMS Industry Study from IPC Forecasts Growth and Reveals Trends
Oct 28, 2011 | After economic setbacks in 2009, the world market for electronics manufacturing services (EMS) returned to growth in 2010, according to a study released by IPC.
IPC Releases PCB Industryh Results For September 2011
Oct 28, 2011 | IPC announced the September findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
First Annual IPC APEX EXPO Hand Soldering Competition Looking for Technicians Who Can Bring It
Oct 28, 2011 | Move over Top Chef and Project Runway, IPC announces the first annual IPC APEX EXPO® Hand Soldering Competition, February 28–29, 2012, at the San Diego Convention Center.
Tulane University Study Finds Dodd-Frank Conflict Minerals Regulations to be One Hundred Times More Costly than SEC Estimate
Oct 24, 2011 | A Tulane University economic analysis, which drew heavily on an IPC survey of the electronics industry, assessed the costs of implementing the Dodd-Frank conflict minerals regulation to be $7.93 billion - more than one hundred times greater than the estimate prepared by the U.S. Securities and Exchange Commission (SEC) of $71.2 million.
IPC Announces Fall Webinar Schedule
Oct 21, 2011 | Offering a cost-effective and convenient way to train employees on timely industry topics, IPC webinars deliver one hour of trusted education to the comfort of companies’ conference rooms. Focused on technical, practical and management issues facing the electronics industry, these sessions are based on award-winning technical papers from IPC APEX EXPO® 2011
Board of Directors Endorses IPC's Long-Term Strategy
Oct 21, 2011 | The Board of Directors for IPC endorsed the association’s long-term strategy at its final meeting in 2011.
IPC Solder Products Value Council Urges Tin Smelters To Engage In Certification For Conflict-Free Smelting
Oct 21, 2011 | IPC’s Solder Products Value Council (SPVC) is actively urging tin smelters to become smelters of conflict-free minerals and recommends the Electronic Industry Citizenship Coalition/Global e-Sustainability Initiative (EICC/GESI) Conflict-Free Smelter (CFS) program.
William Shatner To Keynote IPC Apex Expo 2012
Oct 16, 2011 | With all votes tallied from the special IPC APEX EXPO® keynote speaker election, William Shatner has emerged the clear winner, taking the popular vote by a considerable margin over the other candidates.
IPC Conference Targets Critical Issues for the Military Market
Oct 12, 2011 | Changes in export regulations, transforming military technology trends, and impending defense budget cuts are just three of a host of factors that are altering the business and technology landscapes of the defense market - and all with significant impacts on the electronics manufacturing industry.
Search for New IPC President and CEO Begins
Oct 08, 2011 | IPC is seeking an outstanding individual to become its next president and chief executive officer (CEO). The candidate will succeed current CEO Denny McGuirk, who leaves on November 3 to become president of SEMI, the global industry association serving the nano- and microelectronics manufacturing supply chains.
IPC APEX EXPO 2012 Show Floor and Exhibitors Basking in the Sunshine of San Diego
Oct 08, 2011 | Heralding two exhibit floors at its new home in the San Diego Convention Center, one of which is already completely sold out, IPC APEX EXPO® and its 2012 exhibitors are relishing in the sunshine of the show’s move to San Diego, February 28-March 1, 2012.
- SMTnet
- »
- SMT, PCB Electronics Industry News
- »
- Association Connecting Electronics Industries (IPC)
- »
- Association Connecting Electronics Industries (IPC) News
