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News Releases from ESSEMTEC AG

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220 news releases added by ESSEMTEC AG

Company Information:

Essemtec is a worldwide leader in manufacturing of highly flexible Surface Mount Technology (SMT) production equipment - pick-and-place system, dispenser, printer, oven, storage system and software Solutions.

aesch/LU, Switzerland

Manufacturer

  • Phone 41-419196052
  • Fax 41-419196050

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Company Postings:

(2) used SMT equipment marketplace items

(11) products in the catalog

(220) news releases

Essemtec Won the 2021 Mexico Technology Innovation Award for Its Solder Paste Jet Dispensing Solution

Nov 05, 2021 | Essemtec received a 2021 GLOBAL Technology Award in the category of Mexico Technology Innovation Award for its Fox / Puma with Archerfish Solder Paste Jet Dispensing Solution. The award was announced during a ceremony that took place Wednesday, Nov. 3, 2021 during SMTA International in Minneapolis, MN.

Nano Dimension Acquires Essemtec AG, Surface-Mount Pick & Place Systems Supplier for the PCB and OEM Industries

Nov 05, 2021 | Acquisition lays groundwork for a breakthrough: Microchips placement as part of additively manufactured electronics solution

Essemtec Will Demo New Multi-Function Solder Paste Jetting Solution at Productronica 2021

Oct 13, 2021 | Essemtec will exhibit at Productronica 2021, scheduled to take place Nov. 16-19, 2021 at Neue Messe München in Munich, Germany. The company will highlight its dispensing solution for both the electronics and medical industries in Hall A3, Stand 322.

Essemtec to Show the Latest Innovation for Solder Jet Printing at SMTAI

Oct 07, 2021 | Essemtec will exhibit at the the SMTA International Exposition, scheduled to take place Nov. 3-4, 2021 at the Minneapolis Convention Center in Minneapolis, MN. The company will highlight its dispensing solution for both the electronics and medical industries in Booth #3520.

Essemtec joins forces with Restronics in Florida

Aug 26, 2021 | Essemtec announces that it has hired Restronics as its new manufacturers' representative in Florida. Ms. Joan Carroll Kennedy will represent Essemtec throughout Florida covering the electronics industry.

Flexible Circuits, Inc. uses Essemtec FOX2 for high-rel flex-centric electronic interconnect assemblies

Aug 13, 2021 | Flexible Circuits, Inc. (FCI) purchased a FOX2 multi-function combined pick-and-place and dispensing system. Essemtec's FOX2 combines jetting/dispensing, 2.5D placement, electrical testing, inventory control and traceability in a single machine.

Joe Karcewski, Flexible Circuits Assembly Manager

Essemtec Expands into Puerto Rico with APT

May 25, 2021 | Essemtec announces that it has hired Advanced Process Technologies (APT) Inc. as its manufacturers' representative. Mr. Jorge Acevedo will represent Essemtec throughout Puerto Rico covering the electronics and medical devices industry.

30 Year Anniversary for Swiss Success Story Essemtec

Jan 06, 2021 | Essemtec announces that it will celebrate its 30th anniversary in 2021. The company specializes in high-speed fluid dispensing as well as flexible high-mix SMT placement and storage solutions. All products are designed with the most advanced available technologies, leveraging the company's vast equipment and process know-how gained since 1991.

Essemtec Receives Award for Its Newest Innovation in Solder Jet Printing

Oct 29, 2020 | Essemtec announces that it was awarded a 2020 Mexico Technology Award in the category of Dispensing for its new Archerfish. The award was announced during a Virtual Awards Ceremony on Monday, October 26, 2020.

Essemtec to Host Unique Webinar for Its Newest Innovation in Solder Jet Printing

Aug 15, 2020 | Essemtec announces that it will host a live webinar on Thursday, Aug. 27, 2020. The webinar will be offered in two session at 7 a.m. and 10 a.m. CST, and will be available to join at: https://essemtec.com/live-online-webinar.

Essemtec Cubus Tray Box Storage Allows the Management of Thousands of Parts

Jun 29, 2020 | Essemtec announces that its Essemtec Cubus Tray Box storage feature allows the management of thousands of parts beyond typical SMT components.

Essemtec USA accelerates, for you !

Jun 11, 2020 | Essemtec USA has been active in North America for almost 20 years with more than 1,200 systems installed. In 2013 there was a change of ownership at our Headquarters Essemtec AG in Switzerland. Our new strategy was first to re-engineer and develop the main organization and a new product portfolio. Secondly, we had the clear aim to grow and improve our US organization and operations. This time is now.

World-class Dispensing in a Small Footprint

Jun 11, 2020 | Essemtec announces that its Spider smart-sized high-speed dispenser can be adapted for a wide range of dispensing applications including solder paste and SMT glue, LED encapsulation, silver epoxy, dam and fill, underfill, cavity fill, 3D dispensing via laser height mapping and more.

Precision Assembly Technologies, Inc. uses Essemtec FOX system to solve component failure issue by bringing assembly in-house

May 12, 2020 | Precision Assembly Technologies, Inc. (P.A.T.), based in Bohemia, NY, was seeking a system that could dispense specific solder beads within a component and place the die into position within a housing. The Essemtec FOX2 multi-function combined pick-and-place and dispensing system provided the solution.The new FOX2 combines jetting/dispensing, 2.5D placement, electrical testing, inventory control and traceability in a single machine.

Introducing - The Fox Pack – State-of-the-art Expandable Placement and Dispensing from Essemtec

Apr 23, 2020 | Essemtec announces that its FOX2 smart-sized modular pick-and-place technology is expandable in any direction. The new FOX2 combines jetting/dispensing, 2.5D placement, electrical testing, inventory control and traceability in a single machine.

Essemtec Receives 2019 Mexico Technology Award for Multi-function Component Placement

Oct 24, 2019 | Essemtec announces that it was awarded a 2019 Mexico Technology Award in the category of Component Placement – Multi-function for its FOX2. The award was presented to the company during a Wednesday, Oct. 23, 2019 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum. The new FOX2 combines jetting/dispensing, 2.5D placement, electrical testing, inventory control and traceability in a single machine.

Don Jeka Joins Essemtec AG as Business Development Manager

Jun 30, 2019 | Essemtec AG is pleased to announce the addition of Don Jeka to its US sales team. Jeka has assumed the role of Business Development Manager. In this new position he will work with Essemtec’s sales representatives in parts of the US and Canada. Jeka has been specifically tasked with growing the market for Essemtec’s outstanding products including its award-winning Fox pick-and-place and Spider dispensing platforms.

Don Jeka.

ESSEMTEC and Panasonic Announce Partnership during APEX

Jan 30, 2019 | Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, today announced a new partnership agreement with Panasonic. Under the agreement, Panasonic will sell the Cubus throughout North America. Panasonic’s Certified Technology Program provides the ideal production solution to customers by combining its equipment, software and expertise with complementary third-party technologies to satisfy customer requirements and exceed their expectations.

Essemtec to Show the Latest Dispensing and Jetting Valves at SMTA Guadalajara

Nov 05, 2018 | Essemtec announced plans to exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place November 14-15, 2018. VP of sales for North America Steve Pollock will be onsite showing the latest dispensing and jetting valves and will be available for sales and technical discussions.

Essemtec to Show FOX2 with Micro Valve / Placement System at SMTAI

Sep 17, 2018 | Essemtec will demonstrate the FOX2 with Micro Valve dispensing solder paste for 0201 and 01005 and placing them in same machine for NPI and prototyping.

Essemtec Wins NPI Award for Tarantula All Terrain Jet Dispenser

Feb 28, 2018 | Essemtec has been awarded a 2018 NPI Award in the category of Dispensing for its Tarantula – Relentless All Terrain Jet Dispenser. The system features state-of-the-art technology and can be easily integrated in any line. It is designed for a wide range of dispensing applications such as solder paste and SMT glue, LED encapsulation, silver epoxy, dam and fill, underfill, cavity fill, 3D dispensing via laser height mapping and more.

Essemtec to Show All-in-One High Speed Assembly / Dispensing Platform at APEX

Jan 24, 2018 | Essemtec today announced plans to exhibit in Booth #3525 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca. The company will present a large all-in-one platform that can be used for the assembly of high-speed applications, rapid prototyping and high-speed dispensing. With different modules, the system can grow synchronously with customer requirements for performance and processes. The company also will demonstrate the compact Spider jet dispenser and two FOX² systems – one with the solder paste Jet valve and one with the micro screw valve.

Puma/Tarantula - Essemtec‘s P&P/dispenser innovation at productronica

Oct 16, 2017 | Essemtec will present a large all-in-one platform that can be used for the assembly of high-speed applications, rapid prototyping and high-speed dispensing at productronica 2017. The company will exhibit in Hall A3, Booth 218, Nov. 14 – 17, 2017 at the Messe München in Germany. With different modules, the system can grow synchronously with customer requirements for performance and processes.

Modular expanded Puma with up to 54’300 cph IPC and jetting up to 150'000 dots/h on the first module.

Essemtec to Show New All-in-One Jetting / Placement System at SMTAI

Aug 17, 2017 | Essemtec today announced plans to exhibit in Booth #207 at SMTA International. The company will demonstrate the new FOX2 that combines jetting of solder paste or glue and placement in a single machine.

FOX2 has a machine footprint of just 1m2 and can accept PCB sizes up to 16 x 12

Essemtec to show all-in-one jetting/placement system at SMTA Capital Expo: the perfect NPI machine

Jul 27, 2017 | Essemtec today announced plans to exhibit at the SMTA Capital Show, scheduled to take place on Aug. 24, 2017. The company will demonstrate the FOX2 that combines jetting of solder paste or glue and placement in a single machine.

Essemtec Wins the 2017 NPI Award for Multifunction Placement for the New FOX2

Feb 21, 2017 | Essemtec announces that it has been awarded a 2017 NPI Award in the category of Component Placement – Multifunction for its FOX2. The award was presented to the company during a Tuesday, Feb. 14, 2017 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO. This marks the 15th industry award that the Swiss manufacturer has received in recognition of its production systems for electronic assembly and packaging. The new FOX2 by Essemtec combines jetting of solder paste or glue and placement in a single machine. The new version is based on the original award-winning platform, which is the first machine in its class with linear motors and a mineral cast frame, providing excellent speed, stability, accuracy, and making it perfectly suited for use in small to medium production environments.

New FOX2.

Essemtec Announces Placement & Jetting in a Single Pass Through with the New FOX2

Jan 11, 2017 | Essemtec today announced plans to exhibit in Booth #1223 at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in Calif. Essemtec will debut the FOX² and demonstrate the compact Spider jet dispenser.

FOX².

Juerg Schuepbach Joins Essemtec as International Sales Manager

Nov 21, 2016 | Essemtec AG appointed Juerg Schuepbach as International Sales Manager, effective November 1, 2016. He is responsible for strengthening the company's market presence around the globe and expanding its business into both underserved geographies and complementary industrial segments.

Essemtec's FOX Offers Hassle-Free Manufacturing of 2.5D Assemblies - Learn More at the Upcoming SMTA Expos

Oct 13, 2016 | Essemtec announced plans to exhibit the new FOX Compact Pick-and-Place Machine at the SMTA New England Expo & Tech Forum and the SMTA LA/Orange County Expo & Tech Forum, both on Thursday, November 3, 2016. The New England Expo will take place at the DCU Center in Worcester, MA, and the LA/Orange County Expo will take place at The Grand Event Center in Long Beach, CA. The FOX measures only 88 x 109 cm and it can accept PCBs up to 406 x 305 mm. Components with sizes from 0201 (imperial) up to 33 x 80 mm can be placed, optionally up to 80 x 80 mm.

Essemtec Fox Compact Automatic Pick-and-Place System can have up to 180 feeder lanes, needs only 1sqm of floor space and can accept PCB's of up to 406 x 305 mm.

Essemtec Will Demonstrate the Spider Jet Dispenser at IMAPS 2016 in Pasadena

Sep 12, 2016 | Essemtec today announced plans to exhibit in Booth #224 at IMAPS Pasadena, scheduled to take place Oct. 10-13, 2016 at the Pasadena Convention Center. Essemtec will demonstrate the new compact Spider jet dispenser. The Spider can utilize two dispensing valves rated at up to 150,000 dots per hour. It dispenses 3D patterns and is easily adapted to your application.

Essemtec Spider, the extreme fast and compact jet and general dispenser is rated for up to 150 000 dots per hour, dispenses 3D patterns and much more.

New Compact Pick-and-Place with Linear Motors to be Displayed at SMTA Guadalajara

Sep 06, 2016 | Essemtec today announced plans to exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Oct. 5-6, 2016 at Hotel Riu Guadalajara. The new FOX Compact Pick-and-Place Machine is the first machine in its class with linear motors and a mineral cast frame, providing exceptional speed, stability and accuracy, and making it perfectly suited for use in small production environments.

Essemtec Fox can have up to 180 feeder lanes, needs only 1sqm of floor space and can accept PCB’s of up to 406 x 305 mm.

Essemtec Brings on Captec to Back Continued Growth in Northern CA and NV

May 31, 2016 | Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, today announced that Captec now represents its products in Northern California and Nevada. The Swiss-based company has expanded its North American sales network to back its continued growth.

Kevin McClay, President and Founder of Captec.

Bob Stevenson Joins Essemtec USA to Strengthen North American Reach

May 02, 2016 | Essemtec today announced the appointment of Bob Stevenson to Business Development Manager in the U.S. Stevenson is responsible for strengthening Essemtec’s market presence in North America, bolstering the representative network, and expanding Essemtec’s business into underserved geographies and adjacent technologies.

Bob Stevenson Business Development Manager in the U.S.

Essemtec Will Exhibit 3D Assembly and Jet Printing Solutions at APEX

Feb 17, 2016 | Essemtec today announced that it will exhibit in Booth #962 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. Essemtec will display technical innovations in 3D assembly and jet printing with live demonstrations.

Essemtec’s outstanding 3D jet printing and 3D assembly solutions created great attention at productronica 2015

Dec 08, 2015 | Essemtec recently exhibited exceptional 3D jet printing and 3D assembly solutions at productronica 2015. Additionally, Essemtec presented an integrated work cell especially suitable for manufacturers who have to handle frequent product changes.

Essemtec to Exhibit New Outstanding 3D Assembly and Jet Printing Solutions at productronica 2015

Oct 21, 2015 | Essemtec today announced that it will exhibit in Hall A3, Booth 346 at the productronica International Trade Fair, scheduled to take place Nov. 10-13, 2015 at the Messe München exhibition center in Munich, Germany. Essemtec will display technical innovations in 3D assembly and jet printing with live demonstrations.

The Murray Percival Company Will Offer Live On-Site Demos of Essemtec’s Solder Paste Jetting Technologies and SMD Storage Systems

Oct 06, 2015 | Essemtec today announced that The Murray Percival Company will hold an open house from Oct 20-22, 2015 at its facility. The Murray Percival Company will offer live on-site demonstrations of new solder paste jetting technologies and fully automated SMD storage systems from Essemtec.

Essemtec to Exhibit Flexible SMT Production Equipment at SMTA International

Aug 24, 2015 | Essemtec today announced that it will exhibit in Booth #335 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. Company representatives will demonstrate the Parquda G2 multifunctional center and Cubus storage system.

Parquda G2 multifunctional center.

Essemtec to Participate in ACI Technologies’ Tech Expo

May 12, 2015 | Essemtec today announced that it will participate in ACI Technologies’ second annual Tech Expo, scheduled to take place May 20-21, 2015 at its facility in Philadelphia, PA. Steve Pollock, Vice President of Essemtec USA, will demonstrate the Paraquda G2, Cubus and Lynx on the factory floor.

Lynx – small form factor SMT assembly system.

Essemtec’s SMT Storage System Picks Up An EM Asia Innovation Award

Apr 22, 2015 | Essemtec AG announces that it has been awarded a 2015 EM Asia Innovation Award in the category of Automatic Component Warehouse Systems for its Cubus Next-Generation SMT Storage System. The award was presented to the company during an April 22, 2015 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China.

Cubus Next-Generation SMT Storage System.

Essemtec to Present Innovations at SMT Hybrid Packaging 2015

Apr 06, 2015 | Essemtec AG, the Swiss manufacturer of production systems for electronic assembly and packaging, will exhibit at booth #7.135 at SMT/HYBRID/PACKAGING, scheduled to take place May 5-7, 2015 in Nuremberg. Company representatives will demonstrate the latest generation of Paraquda pick-and-place system and Scorpion dispensing system. Other highlights will be the new SMT storage device Cubus Large and the new highly flexible and cost-effective pick-and-place system Lynx.

Lynx – small form factor SMT assembly system.

Essemtec to Present Innovations at SMT Hybrid Packaging 2015

Mar 10, 2015 | Essemtec AG, the Swiss manufacturer of production systems for electronic assembly and packaging, will exhibit at booth #7.135 at SMT/HYBRID/PACKAGING, scheduled to take place May 5-7, 2015 in Nuremberg. Company representatives will demonstrate the latest generation of Paraquda pick-and-place system and Scorpion dispensing system. Other highlights will be the new SMT storage device Cubus Large and the new highly flexible and cost-effective pick-and-place system Lynx.

Paraquda G2 is the first SMT assembly system to combine 3 processes in one machine

Zollner Invests in Essemtec Dispensing Systems

Mar 07, 2015 | Zollner Elektronik AG, one of the top EMS service providers with 17 locations worldwide, trusts in Essemtecs’ high speed jet dispenser Scorpion.

Zollner Invests in Dispensing Systems from Essemtec

Mar 05, 2015 | Zollner Elektronik AG, one of the top EMS service providers with 17 locations worldwide, trusts in Essemtecs’ high speed jet dispenser Scorpion.

Zollner Invests in Dispensing Systems from Essemtec

Essemtec Highlights 3-in-1 Multi-Functional SMT Center Paraquda at Automaticon 2015

Feb 16, 2015 | At the upcoming AUTOMATICON 2015 exhibition, taking place March 17 - 20 in Warsaw, Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, will highlight its award-winning Paraquda in booth B28, hall 1. Essemtec is the first manufacturer that developed a combined SMT production center that is able to jet solder paste and/or glue and mount components in one machine.

Paraquda - multifunctional 3-in-1 production center (jet printing of solder paste and/or glue and SMD assembly)

Essemtec to Debut New Small Form Factor SMT Assembly System at APEX

Jan 22, 2015 | Essemtec will exhibit in Booth #1211 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Company representatives will demonstrate the multi-functional SMT center Paraquda, Cubus SMT storage device and the new Lynx highly flexible and accurate pick-and-place system.

Lynx - highly flexible and accurate pick-and-place system.

Essemtec AG Awarded Contract for 100 Cubus SMT Storage Systems

Jan 21, 2015 | A leading SMT equipment manufacturer has concluded an important contract with Essemtec AG for the supply of 100 Cubus systems to be delivered in the coming 12 months. The first systems have been delivered to Southeast Asia and to multiple sites in Europe.

Cubus – the next generation of SMT storage.

Essemtec AG Awarded Contract for 100 Cubus SMT Storage Systems

Jan 21, 2015 | A leading SMT equipment manufacturer has concluded an important contract with Essemtec AG for the supply of 100 Cubus systems to be delivered in the coming 12 months. The first systems have been delivered to Southeast Asia and to multiple sites in Europe.

Cubus storage device is fully user configurable and thus adapts to the ever-changing manufacturing needs.

TE-LOH Michael Korn KG Invests in Essemtec Equipment

Jan 14, 2015 | The North German electronics manufacturer TE-LOH Michael Korn KG is expanding its production line with a SMD assembler and a reflow oven from Essemtec.

Our new Paraquda placement machine enables precise and process-optimized work and fits in well with our usual high quality standards. In addition, it is characterized by its flexibility of component parts and PCB formats, as well as the ease of programming and the reliability of the assembly from batch size 1,

Essemtec to Debut New Small Form Factor SMT Assembly System at APEX

Jan 07, 2015 | Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, will exhibit in Booth #1211 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Company representatives will demonstrate the multi-functional SMT center Paraquda, Cubus SMT storage device and the new Lynx highly flexible and accurate pick-and-place system.

Lynx - highly flexible and accurate pick-and-place system

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