Nov 05, 2019 | The board stack-up is probably the most essential piece for ensuring a successful PCB design. Modern high-speed boards require controlled-impedance traces, and whether you are using a simulation tool, a simple calculator, or the back of a napkin, you need to understand your manufacturing process to correlate your impedance calculations. This ensures that your trace widths and dielectric heights match what will actually be manufactured, and eliminates last-minute design changes.
Nov 05, 2019 | Backdrill is the process of creating vias by removing the stub in multilayer_ed printed wiring boards, to allow signals to flow from one layer of the board to another. It is a special craftsmanship of control depth drilling.
Nov 05, 2019 | Designing a PCB for automatic assembly and full production runs requires a few design changes from an initial prototype PCB run. Today most PCBs are assembled and tested with automated machines from the data from PCB drawing files. With up to 80% of a new product's cost determined by the first prototype build, avoiding late changes and designing with manufacturing in mind can have a significant impact on the product cost, reliability, and yield of a PCB design. Luckily, if some good choices are made early in the design process, designing a PCB for manufacturing is relatively straight forward with few pitfalls.
Nov 05, 2019 | The basic principle of a press-fit connection is that a contact terminal is pressed into a printed circuit board (PCB). There are two types of press-fit pins – the solid pin with a solid press-in zone and the compliant pin with an elastic press-in zone. In this article, we’ll discuss the elastic press-in zone.
Nov 05, 2019 | 1. The definition of Sideplating Sideplating is actually the metalization of the board edge in PCB filed. Edge plating、Border plated、plated contour、side metal, these words can be used too to describe same function. 2. Sideplating Process Drilling - Milling plated Slots - Cleaning - Copper sink 3. Pictures to show the finished board’s sideplating
Nov 05, 2019 | Very often, customers ask details about what kind of testing do we use? How do we charge it? Do I have to pay every time or only for the first time? Is this testing safer and better than other one? etc In this blog, let's discuss the various kind of testing and their advantages and disadvantages. Some of them are mandatory, some of them are optional; Some of them are fast, some are slow; some of them are more reliable, and some not. Hope you will have a better understanding about various kinds testing and make better decision on your next PCB order.
Nov 05, 2019 | 8 Layer PCB Stack-up Guidelines How to improve EMC performance on 8 layer PCB design? The following text is reproduced, with permission, from Part 4 of a 6-Part article on PCB Stackup by Henry W. Ott. The original article is available at http://www.hottconsultants.com/tips.html
Nov 05, 2019 | WHAT IS RIGID-FLEX PCB? Rigid-flex PCB is a printed circuit consisting of both flexible circuit and rigid circuit. This combination is ideal for exploiting the benefits of both flexible and rigid circuits - the rigid circuits can carry all or the bulk of the components, with the flexible sections acting as interconnections between the rigid sections. Most rigid-flex circuit boards consist of multiple layers of flexible circuit substrates attached to rigid boards externally and/or internally. The flexible substrates are designed to be in a constant state of flex, and are usually formed in a flexed curve during manufacturing or installation. This is dependent upon the design of the application.
Nov 05, 2019 | Home > > News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Nov 05, 2019 | Plated half holes（castellated holes）are holes that made off the edge of the boards plated with copper using a specialized process. It is predominantly used for board-on-board connections, mostly where two printed circuit boards with different technologies are combined. Through connecting the PCBs together directly, the whole system is considerably thinner than a comparable connection with multi-pin connectors.The plated edges are also useful in producing mini PCB modules.
Nov 05, 2019 | Flex PCBs are thin, light weight and easy bending, this gives much difficulty in the process of component assembly. Stiffeners are used to reinforce those areas where components will be assembled. There are many different material can be used as stiffeners, like polyimide, kapton, FR-4, Aluminium, etc, designer need to select the right material based on their thickness and characteristics.
Nov 05, 2019 | Many customers and electronic designers were asking questions about the aluminum-based board, today our chief technical official Luca Zhang shared the knowledge and experience to you.
Nov 05, 2019 | Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.
Nov 05, 2019 | Tenting a via refers to covering via with soldermask to enclose or skin over the opening. A via is a hole drilled into the PCB that allows multiple layers on the PCB to be connected to each other. A non tented via is just a via that is not covered with the soldermask layer. Leaving these vias exposed or covered has pros and cons depending on the your design and manufacturing requirements.
Nov 05, 2019 | The printed circuit board, or PCB, is responsible for connecting all the components with each other in your electronic assembly. Making just one tiny error in the design could lead to complete failure. PCB layout design requires ardent precision and great technological skills.
May 16, 2019 | There are several surface treatment for PCB board: bare board (no treatment on the surface), rosin board, OSP (Organic Solderability Preservatives), HASL (lead tin, lead-free tin), plating gold, immersion gold, etc., these are relatively conscious treatment. Many people can't tell the difference between plating gold and immersion gold, thinking that it is the same thing, it is a big mistake. The following is a brief introduction to the difference between plating gold and immersion gold.
May 16, 2019 | With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development trend. The application of the resin plugging process has also become more and more extensive, and it has been used in HDI panels.
May 16, 2019 | Many Cusromers inquiry Headpcb's capabilty of counter sink board, and they are easy to mismatch counter sink with counterbore. In fact, there have big difference between counter sink and counterbore, today Headpcb's senior RD engineer Macros Zhang spare an article about counter sink and counterbore, hope this will help you having a better understanding about them.
Jul 10, 2012 | Head Electronic Co., Ltd. is an experienced professional manufacturer of printed circuit boards in mainland China since 2000. We are specialized in PCB manufacturing, PCB prototype and PCB Fabrication.