May 15, 2012 
AIM, a leading global manufacturer of solder assembly materials for electronics assembly, PC fabrication, component manufacturing and other industries, announces that Tim O’Neill, Northeastern Regional Sales Manager, will present on Lead-Free Alloy Development at the Ohio Valley SMTA Solder Paste Round Table Meeting, scheduled to take place on Friday, May 18, 2012 from 9 a.m.-3 p.m.
The purpose of this paper is to investigate several factors relating to the families of alloys, both low silver and non-silver. These factors include the use of these alloys as possible replacement alloys in solder paste for component attachment, and the comparison of the paste medium chemistries of these alloys and the effects they have as it relates to assembly performance. This paper places alloys in classes of risk for drop shock and thermal shock. Other important characteristics that will be addressed include wetting, voiding and HiP mitigation.
Tim O’Neill has a B.A. from Assumption College and post-graduate studies in education. He has nearly 20 years of experience in the electronics soldering industry, beginning his career in 1994 with EFD and was key in business development of their fine-pitch solder paste dispensing technology. Mr. O’Neill joined AIM in 1997 and has since assisted many clients with assembly challenges, specializing in lead-free process development and material selection.
Headquartered in Montreal, Canada, AIM is a leading global manufacturer of assembly materials for the electronics industry. The company produces solder paste, liquid flux, cored wire, bar solder, adhesives, preforms, and specialty alloys such as indium and gold for electronics assembly, PC fabrication, component manufacturing and other industries. For more information, visit AIM on the Web at www.aimsolder.com, or e-mail info@aimsolder.com.
