May 20, 2019 SMTA recently released the Guide to BGA Assembly & Soldering Defects, a complimentary resource for the electronics manufacturing industry. The book was written by Keith Bryant, industry veteran and Chairman of the SMTA Europe Chapter, and reviewed by members of the SMTA Europe Technical Committee.
The full-color booklet features high quality images of both optical and X-ray examples of common and not-so-common defects affecting Ball Grid Array (BGA) and Area Array components during assembly. The examples include cosmetic or electrical failures found during investigation in manufacture. Each defect type is discussed with possible causes and cures.
Thanks to the support of YXLON, the official sponsor of the defect guide, SMTA could make this resource available as a complimentary download. Association members can simply log in to download the guide, and non-members just need to complete a short registration form to get access to the electronic document.
For more information, contact Ryan Flaherty: ryan@smta.org or +1-952-920-7682 or visit https://www.smta.org/knowledge/defect-guide/ The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
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