Feb 22, 2008 SMTA�s 3D/SiP Advanced Packaging Symposium will cover a wide range of application opportunities assessing the market, technology and business implications of three dimensional assembly technologies at both the package and product levels. Topical coverage runs the gamut from chip stacks and origami semiconductor packaging through package on package (PoP) board level assembly. Speakers review technical, business and intellectual property aspects of 3D packaging and assembly for products ranging from consumer and commercial to military and medical devices leading to a better understanding of potential matches between various 3D technologies and specific product applications.
Highlights
- April 28th - Half-day tutorial on �3D Packaging Applications, Requirements, Infrastructure and Technologies� led by Lee Smith of Amkor Technology
- April 29th - Keynote address by Dongkai Shangguan, Flextronics
- April 29th � Welcome Reception
- April 30th - Keynote address by Judy Priest, Cisco Systems
If you are interested in group discounts or have any other questions on this program, please contact Melissa Serres at melissa@smta.org or 952-920-7682. For registration and more information on the SMTA 3D/SiP Advanced Packaging Symposium please visit the website: http://www.smta.org/education/symposia/symposia.cfm#ap
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
»
