SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • 2008 International Wafer-Level Packaging Conference Delivers During Tough Times

2008 International Wafer-Level Packaging Conference Delivers During Tough Times

Nov 14, 2008

San Jose, CA � The 5th Annual International Wafer-Level Packaging Conference ended 2008 with success, bringing in its highest attendance yet.

The four-day program began with two-days of half-day tutorials on topics ranging from IC Packaging to Failure Modes & Analysis of Flip-Chip Assemblies given by leading instructors in the industry.

The conference line-up opened with the popular Business and Marketing Panel Discussion, featuring panelists Jan Vardaman, TechSearch International; Jim Walker, Gartner/Dataquest; Dr. Eric Mounier; Yole D�veloppement, and Dan Tracy, SEMI. The day closed with a keynote presentation from Dr. Thomas H. Di Stefano of Centipede Systems on �Wafer-Level Packaging: The Promise Evolves.�

A new panel topic for 2008, "Where in the World?", included expert panelists who addressed the risks and rewards of establishing a semiconductor-related business in locations that include China, India, Mexico and Vietnam.

The IWLPC featured 50 tabletop exhibit displays and over 40 technical presentations. Over 400 attendees came from 19 countries, including Austria, China, Finland, France, Germany, Hong Kong, Israel, Japan, Liechtenstein, Malaysia, Morocco, Norway, Republic of Korea, Singapore, Sweden, Switzerland, Taiwan, United Kingdom and the United States.

The IWLPC Conference Proceedings are available for purchase in the SMTA Bookstore at http://www.smta.org/store/book_store.cfm.

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

May 27, 2022 -

Symposium on Counterfeit Parts and Materials Program Finalized

May 18, 2022 -

SMTA Capital Chapter Expo - Advanced Manufacturing on Supply Chain Solutions

May 05, 2022 -

SMTA Announces Technical Program for International Conference for Electronics Hardware Enabling Technologies (ICEHET)

Apr 13, 2022 -

SMTA Capital Chapter's Expo and Tech Forum to be Held on May 24th

Apr 13, 2022 -

Upcoming SMT Processes Certification Dates in North America

Feb 25, 2022 -

SMT Processes Certification, Harsh Environments Conference Coming to Amsterdam

Feb 16, 2022 -

Seeking Student Applications for 2022 Stromberg Scholarship

Feb 10, 2022 -

2022 Charles Hutchins Grant Now Open for Applications

Jan 10, 2022 -

Dr. Vahid Akhavan, NovaCentrix, to Present at SMTA Capital Chapter Meeting on January 20th

Dec 21, 2021 -

Wafer-Level Packaging Symposium (WLPS) Program Announced and Registration Now Open

685 more news from Surface Mount Technology Association (SMTA) »

Jul 06, 2022 -

Offline PCBA Cleaning Machine HJS-7100,rosin flux, non-clean flux,water-soluble flux cleaning machine

Jul 05, 2022 -

Semiconductor Spray Cleaning Machine HJS-9700,Semiconductor Wafer Cleaning Machine HJS-9700

Jul 04, 2022 -

Pneumatic Stencil Cleaner HJS-9000II,dual chamber stencil cleaning machine

Jul 03, 2022 -

Electric Stencil Cleaner HJS-9500, SMT Electric Stencil Cleaner HJS-9500

Jul 01, 2022 -

Screen Cleaning Machine HJS-4600, SMT Screen Cleaning Machine HJS-4600

Jun 30, 2022 -

Electric Fixture Cleaning Machine HJS-6700, SMT pallet cleaning machine, soldering pallet cleaning machine

Jun 29, 2022 -

Waste Water Treatment Machine RWT-1000, SMT Waste Water Treatment Machine RWT-1000

Jun 28, 2022 -

Gen3's Dr Chris Hunt, CTO submits an insightful paper to the journal of Surface Mount Technology

Jun 28, 2022 -

Squeegee Cleaning Machine HJS-3700,SMT Squeegee Cleaning Machine HJS-3700

Jun 27, 2022 -

Solderstar Celebrates 20 Years of Innovation

See electronics manufacturing industry news »

2008 International Wafer-Level Packaging Conference Delivers During Tough Times news release has been viewed 490 times

  • SMTnet
  • »
  • Industry News
  • »
  • 2008 International Wafer-Level Packaging Conference Delivers During Tough Times
Non-heated dispensing system

Reflow Oven