Apr 23, 2009 Assembly
- Lean Manufacturing
- Low volume / Prototype assembly
- Medical electronic
- Rework and repair of QFNs
- Selective Soldering
- Set up reduction
- Vapor phase reflow for high reliability assemblies
- Yield Improvement
- Under fill Applications and issues
Components
- Chip scale packages, including WL-CSP, LGA
- Multichip packages, including 3D packaging
- Tin Whiskers
Emerging Technologies
- Embedded Technology/ Actives and Assembly
- Optoelectronics
- Solar Technology
- System in a Package
- Power and Thermal Management
Harsh Environment Applications
- Lead Free issue for Harsh environments
- Potting
- Conformal Coating
PCB Technology
- Black pad and surface finish defects
- Halogen Free, ROHS, Green products requirements
Abstracts (300 words) are due June 19, 2009. The abstract and presentation must be non-commercial in nature and emphasize the technology and not the company portfolio. Full contact information and a presentation title must be included with the abstract submission. Abstracts can be uploaded online at:
http://www.smta.org/education/education.cfm#asia_pacific
Contact the Conference Coordinator, Melissa Serres Marx, with questions or comments.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
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