Jan 22, 2010
February Offerings include:
Reducing Head-in-Pillow with Tin-Lead and Lead-Free Solder Paste Development Webinar
February 4, 2010
11:00am to 12:30pm Eastern
Presented by: Jasbir Bath, Christopher Associates, Inc. and Koki Solder
The presenter will examine the results of an evaluation of tin-lead and lead-free solder pastes developed with flux formulations to analyze the head in pillow defect.
Package on Package (PoP), STACK Assembly, Rework and Inspection Webtorial
February 4 and 11, 2010 (Presented in two parts)
1:00pm to 2:30pm Eastern
Presented by: Bob Willis, ASKbobwillis.com
This webtorial is ideally suited to design, production and quality engineers looking at future technology and is vital to subcontractors to be up-to-date with new technology and its possible implementation along with material and equipment requirements for future customers.
Pb-free Reflow and Wave Soldering Yield Improvement Webtorial
February 9 and 16, 2010 (Presented in two parts)
1:00pm to 2:30pm Eastern
Presented by: Rob Rowland, RadiSys Corporation
The presentation will cover four critical factors of soldering profile influence plus time and temperature profiles, zone and preheat parameters, conveyor speed calculation, profiling methods, profiling equipment and mixed alloy (Sn/Pb and Pb-free) soldering.
Webinars are 60 to 90 minute online presentations comparable to a conference session. Webtorials are two-part (90 minutes each part) online presentations that provide more depth on a subject and are comparable to half-day tutorials.
For more information contact Ryan Flaherty at 952-920-7682 or ryan@smta.org or visit the online presentations page at http://www.smta.org/education/presentations/presentations.cfm.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
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