May 09, 2017 
Viscom is pleased to announce that it has been awarded a 2017 EM Asia Innovation Award in the category of Test Measurement / Inspection System: AOI for the S3088 ultra blue. The award was presented to the company during an April 26, 2017 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China. This marks the company’s second award in Asia for the system, following the SMT China Vision Award ceremony the day before.
The S3088 ultra blue addresses the growing demand for reliable and easy-to-use 3D AOI technology at an economical price. One orthogonal and four angled view cameras provide full 3D defect detection coverage for components and solder joints on PCBs. The algorithm-based technology that Viscom provides will deliver greater measurement accuracy while inspecting components and solder joints, which in-turn provides feedback to gain tighter process control to optimize the overall quality for each product being produced.
Established in 2006, the EM Asia Innovation Awards program strives to recognize and celebrate excellence in the Asian electronics industry, inspiring companies to achieve the highest standards and push the industry forward.
Viscom AG manufactures and sells high-quality automatic optical and X-ray inspection systems. The company is one of the leading suppliers of 3D solder paste inspection, component placement and solder joint inspection equipment in the PCB assembly market. Viscom systems ensure quality in surface mount technology production lines, where they can be interlinked to further improve productivity. The company’s headquarters and manufacturing operation is located in Hanover, Germany. With a wide network of branches, applications and service centers, Viscom is represented throughout Europe, Asia and the Americas. Founded in 1984, Viscom has been listed on the Frankfurt Stock Exchange (ISIN: DE0007846867) since 2006. For more information, visit www.viscom.com.
