Aug 28, 2009 
This subcommittee is combining and updating four cleaning handbooks into a single document. The base documents are IPC-SC-60, “Post Solder Solvent Cleaning Handbook” IPC-SA-61, “Post Solder Semi-Aqueous Cleaning Handbook” IPC-AC-62, “Aqueous Post Solder Cleaning Handbook” and IPC-CH-65, “Guidelines for Cleaning of Printed Boards and Assemblies.”
The pace of technology development and innovation has created an expectation that products will perform upon demand. Technology advances create the need for highly complex circuitry driven by improved performance, miniaturization, and circuit density.
To address these challenges, the task group has developed 14 sections that address cleaning value, assembly design, materials compatibility, process control verification, assembly residues, post assembly cleaning issues, environmental and safety concerns, solvent cleaning, semi-aqueous cleaning, aqueous cleaning, and rework and repair. The goal of this meeting is to review the working drafts, set in motion a project plan that moves toward final drafts for industry review, and publishing at APEX 2010.
For more information, or to view the schedule of events, visit http://www.ipcmidwestshow.org/html/main/default.htm.
Kyzen is a leading supplier of precision cleaning chemistries to the worldwide electronics, metal finishing, medical, semiconductor, and optics industries. Founded in 1990, Kyzen offers superior cleaning chemistries, technical support, application and analytical services throughout the world. Facilities located in Europe and the USA, Kyzen is a three-time SMT Vision Award winner and all Kyzen products are RoHS compliant.
