Apr 09, 2002 Utica, NY
Indium Corp. of America (Utica, NY), a manufacturer of electronic assembly materials, today announced an optimized, lead-free assembly solution for electronics manufacturers. The program, known as QuickStart, was the result of more than two years of collaborative research and development between Indium and Motorola (Schaumburg, IL) in the lead-free circuit board assembly process.
QuickStart has been fielded in more than 100,000 Motorola mobile phones to date, and Indium is now positioned to transfer this lead-free assembly solution knowledge across the electronics manufacturing industry. According to a press release issued by Indium, this advanced solution will allow customers a quick and cost effective implementation method based on Motorola's in-depth research and quantitative analysis.
The solution was designed to provide a comprehensive analysis of the demanding lead-free manufacturing process, including: alloy selection; solder paste screen printing evaluation; reflow process development; tackiness measurements; solder joint reliability evaluation; product electrical and mechanical evaluation; environmental testing; flux vehicle technology; aging experiments; testing catastrophic mechanical failure; metallurgical analysis of the interconnects following exposure to elevated temperature and mechanical stress; and statistical analysis of test results.
