Jan 09, 2007
In his new role, Tim is responsible for supporting Indium�s advanced material development for PCBA products, including market development, product release, supply chain, and branding. Tim was previously the Program Manager for Indium�s Pb-Free Programs and a Senior Technical Support Engineer for Interconnect Materials. He has a Bachelor�s Degree in Chemical Engineering from Clarkson University. In his previous role, Tim spent over seven years troubleshooting and optimizing SMT process lines. He has authored technical publications and numerous process and technical guidelines. He is a member of several professional societies and participates actively in IPC standards development committees. Tim resides in Utica, NY, USA.
Jordan is responsible for all product activities associated with Thermal Applications, including Indium�s Soft Metal Alloy-Thermal Interface Materials (SMA-TIM) and Solder Thermal Interface Materials (STIM). Jordan joined Indium in 2005 as a Product Specialist for Engineered Solders. He has a bachelor�s degree in Business Administration from the State University of New York, Institute of Technology. Jordan lives in Whitesboro, NY, USA.
Indium Corporation is a four-time Frost & Sullivan Award-winning supplier of electronics assembly and semiconductor packaging materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world�s premiere supplier of commercial grade and high-purity indium. Factories are located in the USA, the United Kingdom, Singapore, and China. Founded in 1934, the company is ISO 9001 registered.
For more information about Indium Corporation visit http://www.indium.com or email askus@indium.com.
