Apr 09, 2010
- Ning-Cheng Lee, Ph.D, Vice President of Technology
- Ronald C. Lasky, Ph.D. PE, Senior Technologist
- Mario Scalzo, Senior Technical Support Engineer
- Eric Bastow, Senior Technical Support Engineer
- Chris Anglin, Applications Development Engineer
Dr. Lee is presenting three papers:
Lead-Free Flux Technology and Influence on Cleaning.
Lead-free, cost pressures, and the never-ending question of "how clean is clean?" present assembly operations with constant challenges. This paper addresses those challenges. Tuesday, April 6 – 1:30 - 3:00pm
Selection of Dip Transfer Fluxes and Solder Pastes for PoP Assembly.
This paper discusses the market outlook, assembly process methodologies and key infrastructure elements that have evolved to enable integrating the new generations of high-performance discreet logic and memory die elements within a single package outline. Wednesday, April 7 – 10:15 – 11:45am
Achieving High Reliability Low-Cost Lead-Free SAC Solder Joints Via Mn or Ce Doping.
In this study, low Ag SAC alloys doped with Mn or Ce were evaluated against eutectic SnPb, SAC105, and SAC305 for JEDEC drop, dynamic bending test, temperature cycling, and cyclic bending tests. Wednesday, April 7 – 1:30 – 3:30pm
He will also be presenting a professional development course:
Achieving High Reliability for Lead-Free Solder Joints – Materials Consideration.
This course addresses how multiple factors contribute to failure modes, and how to select proper solder alloys and surface finishes to achieve high reliability. Friday, April 9 – 9:00am – 12:00pm
Dr. Lasky will be presenting a professional development course:
Lead-Free Reliability
This course will cover how to develop a strategy for compliant electronic assembly with high yields and excellent reliability while complying with global environmental regulations. Thursday, April 8 – 9:00am – 12:00pm
Mario Scalzo will be presenting the paper:
Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly.
This paper discusses the head-in-pillow failure mode and a strategy to minimize this troublesome defect. Wednesday, April 7 – 9:00 – 10:00am
He will also be presenting a paper authored by Tim Jensen
Challenges for Implementing a Halogen-Free Process.
Replacing halogenated compounds can have a dramatic affect on the PCB assembly process. This paper discusses those challenges, as well as techniques and practices that help ensure high end-of-line yields and continued reliability. Thursday, April 8 – 10:15 – 11:45am
Eric Bastow will be presenting:
Understanding SIR.
This paper will discuss the issue of SIR coupon preparation, board cleaning techniques, and how board. Wednesday, April 7 – 10:15 – 11:45am
Chris Anglin will be presenting the paper:
Stencil Printing Transfer Efficiency of Circular vs. Square Apertures with the Same Solder Paste Volume.
This paper addresses the issues associated with stencil and squeegee design and the printing of paste for small passives. Thursday, April 8 – 10:15 – 11:45am
Indium Corporation is also exhibiting at booth #441.
Sponsored by IPC, this technical conference is known worldwide as one of the finest and most selective in the world.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of solder pastes, fluxes, high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high-performance and low-cost of ownership. Dr. Lee is also a member of the SMTAI planning committee.
Dr. Lasky, holder of the prestigious SMTA Founder's Award, is a world-renown process expert and an Instructional Professor at Dartmouth College. He has over 25 years of experience in electronics and optoelectronic packaging and assembly. He has authored or edited five books and numerous technical papers and holds several patent disclosures. Dr. Lasky also authors a technology blog which can be found at http://www.indium.com/drlasky .
Tim Jensen is the Product Manager for PCB Assembly Materials in Indium Corporation's Solder Products Business Unit. He is an SMTA-Certified SMT Process Engineer.
He has spent over a decade troubleshooting and optimizing SMT process lines. He works closely with Indium's Technical Service, Research & Development, and Sales Teams to ensure that Indium continues to offer cutting edge products to meet unique challenges in the electronics assembly industry. Tim has a bachelor’s degree in Chemical Engineering from Clarkson University. He has authored several technical publications and numerous process and technical guidelines. Tim is a member of the SMTA and participates actively in several IPC standards development committees.
Eric Bastow joined Indium Corporation in 2001 developing new solder paste flux chemistries under the direction of Dr. Ning-Cheng Lee. He also gained experience performing residual gas analysis of hermetic electronic packages and developing electroless nickel-plating bath chemistries. Eric is an SMTA-certified process engineer (CSMTPE) and has earned his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College. He has an associate’s degree in Engineering Science from the State University of New York and has authored several technical papers and articles.
Mario Scalzo joined Indium Corporation in 2000. He holds a bachelor’s degree in Chemistry from Saint Anselm College. He also holds a certificate from the American Chemical Society for Professional Education. In addition, he is an SMTA-Certified Process Engineer and has a Six-Sigma Black Belt from Dartmouth College’s Thayer School of Engineering. He is also the author of the Electronics Assembly Materials blog, http://www.indium.com/blogs/Mario-Scalzo-Blog/.
Chris Anglin has over 15 years of experience in advanced process development, new product introduction, and electronics assembly manufacturing. He has a master’s degree in Industrial Engineering from the State University of New York at Binghamton. He is trained in Six Sigma Black Belt programs and is also an SMTA-Certified Process engineer.
For more information about the technical conferences and APEX, visit http://www.goipcshows.org.
Indium Corporation is a premiere materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
