Dec 07, 2011 
Professional Development for Staff and Managers with Interests in Design
Innovations and best practices will be featured in the IPC Designers Forum and design-focused courses at IPC APEX EXPO 2012, February 26-March 1, at the San Diego Convention Center. Experts from Northrop Grumman, Honeywell International, L-3 Avionics Systems, Plexus Corp. and other industry leaders will share insights into taking command of technologies and processes for the next generation of electronics.
“In today’s high-tech, competitive and socially responsible environment, it’s imperative that we all understand the choices available in materials, processes, requirements, quality and parts - as well as how those choices impact the final design’s performance and reliability,” says Dieter Bergman, IPC director of technology transfer. “Most important, is how to convey these requirements to the manufacturing supply chain.”
With benefits for staff and managers in engineering, sales, purchasing, layout, library and quality departments, the IPC Designers Forum on Monday, February 27, is a half-day program of education and technical exchange on critical design issues. Bergman will kick off the Forum with a discussion of the next level of information exchange. Other subject matter experts joining him include: Karen McConnell, CID, Northrop Grumman, who will discuss the documentation paradigm shift from drawings to data; Tom Hausherr, CID+, PCB Libraries, Inc. will discuss optimal design; Vern Solberg, Solberg Consulting, will share insights into flexible circuit applications and design standards; and Rick Hartley, CID, L-3 Avionics Systems, will talk about tough choices in cost/quality trade-offs.
In addition to the IPC Designers Forum, several professional development courses held February 26-27 and March 1, focus on meeting the informational needs of today’s designers. Courses include:
- PD08: Design for Manufacturing - DFM
- PD11: Designing with Flex in Mind: Next Generation
- PD12: Design and Packaging for Space Hardware and Other High-Reliability Applications
- PD14: Signal Integrity Problem Prevention: High-Speed Routing & Termination
- PD21: Basics of PCB Design
- PD35 and PD50: Design for Flexible and Rigid-Flex Circuits (two parts)
- PD36: Control of EMI Coupling Mechanisms
- PD41: Designing PCB Stackups to Balance Signal Integrity Against Manufacturability
- PD43: Designing Complex Boards
- PD44: Package-on-Package Design, Assembly, Rework and Inspection
- PD45: Front-End Engineering Perspective on Design Issues
For PCB designers who want to earn the professional credential that demonstrates organizational and personal excellence to customers and suppliers, IPC designer certification workshops (CID and CID+) will take place on the days preceding IPC APEX EXPO. The two-day workshops will be held February 24–25 with the final exam being given on February 26. Registration for the CID or CID+ workshops is available at www.ipc.org/designer-certification.
To view all design-related programs to be held at IPC APEX EXPO, visit www.IPCAPEXEXPO.org/design.
For more information or to register for the IPC Designers Forum, IPC professional development courses, or any other IPC APEX EXPO activities including the industry’s premier technical conference, standards development meetings, and the largest exhibition in North America for printed board design and manufacturing, electronics assembly and test, visit www.IPCAPEXEXPO.org.
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,000 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.02 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.
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