Apr 15, 2009
The awards were presented to individuals who made significant contributions to IPC and the electronics manufacturing industry by lending their time and expertise to standards development committees and program development.
Special Recognition award recipients were:
- Floyd Bertagnolli, STM, for his contributions to the wire splicing training video, DVD-61C.
- Mike Bixenman, Kyzen Corporation, for his leadership in organizing the IPC/SMTA Cleaning Conference held October 2008.
- Curtis Grosskopf, IBM Corporation, for his contributions to J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.
Distinguished Committee Leadership awards went to:
- Steven Martell, Sonoscan Inc., for his leadership of the IPC B-10A Task Group and the joint ECA/IPC/JEDEC Working Group that developed J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.
- Jack McCullen, Intel Corporation and Paul Krystek, IBM Corporation, for their leadership of the joint ECA/IPC/JEDEC Working Group that developed J-STD-075.
- Darrin Dodson, Alcatel-Lucent, for leadership of the 7-31b Task Group that developed IPC-A-610DC, Telecom Addendum.
- Michael Hill, Colonial Circuits, Inc., for leadership of the 7-32c Electrical Continuity Task Group that helped develop IPC-9252A, Requirements for Electrical Testing of Unpopulated Printed Boards.
- G. Sidney Cox, E.I. du Pont de Nemours and Co. and Michael Luke, Raytheon Company, for their leadership of the D-53 Embedded Device Performance Subcommittee that helped develop IPC-6017, Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices.
- Renee Michalkiewicz, Trace Laboratories � East and John Rohlfing, Delphi Electronics and Safety, in recognition of their leadership of the 5-24a Flux Specification Task Group that developed J-STD-004B, Requirements for Soldering Fluxes.
- Gerard O'Brien, Solderability Testing and Solutions, Inc. and Michael Freda, Sun Microsystems Inc., for their leadership of the D-32 Thermal Stress Test Method Subcommittee that helped develop the new IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation.
- Vern Solberg, Solberg Technical Consulting, for leadership of the 5-21g Flip Chip Mounting Strategy Task Group that developed IPC-7094, Design and Assembly Process Implementation for Flip Chip and Die Size Components.
- Valerie St. Cyr, Teradyne Inc., for her leadership in the development of �Embedded Passives: An Overview of Implementation, Benefits and Costs,� an IPC White Paper.
Distinguished Committee Service awards were presented to:
- Werner Engelmaier, Engelmaier Associates, L.C.; Gerald Leslie Bogert, Bechtel Plant Machinery Inc. and Joseph Smetana, Alcatel-Lucent, for their contributions to J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.
- William Dieffenbacher, BAE Systems Platform Solutions; Don Dupriest, Lockheed Martin Missiles and Fire Control; Timothy Estes, Conductor Analysis Technologies, Inc.; Gary Long, Intel Corporation.; Ronald Rhodes, Conductor Analysis Technologies, Inc.; Valerie St. Cyr, Teradyne Inc.; Vicka White, Honeywell Inc. Air Transport Systems; Dewey Whittaker, Honeywell Inc. Air Transport Systems and David Wolf, Conductor Analysis Technologies, Inc., for their contributions to the IPC-PCQR� database program for benchmarking of printed board fabricator capability.
- Steven Smith, Fujitsu Network Communications, and Jennifer Day, for their contributions to the IPC-A-610DC, Telecom Addendum.
- Alan Exley, Raytheon Company; Guy Ferraro, Beamind; Michael Green, Lockheed Martin Space Systems Company; Clifford Maddox, Boeing Company and Adelino Sousa, MicroCraft K.K., for their contributions to IPC-9252A, Requirements for Electrical Testing of Unpopulated Printed Boards.
- David Adams, Rockwell Collins; Hue Green, Lockheed Martin Space Systems Company; Helen Holder, Hewlett-Packard Company; David Sbiroli, Indium Corporation of America; David Scheiner, Kester; Karen Tellefsen, Cookson Electronics; Dung Tiet, Lockheed Martin Space Systems Company and Brian Toleno, Henkel Corporation, for contributions to J-STD-004B, Requirements for Soldering Fluxes.
- Timothy Estes, Conductor Analysis Technologies, Inc.; Clifford Maddox, Boeing Company; Chris Mahanna, Robisan Laboratory, Inc.; Michael Paddack, Boeing Company; Vicka White, Honeywell Inc. Air Transport Systems and Dewey Whittaker, Honeywell Inc. Air Transport Systems, for their contributions to IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation.
- Werner Engelmaier, Engelmaier Associates, L.C., for his contributions to IPC-7094, Design and Assembly Process Implementation for Flip Chip and Die Size Components.
For more information on these awards and the award recipients, contact Anna Garrido, IPC director of marketing and communications, at +1 847-597-2804 or AnnaGarrido@ipc.org.
About IPC IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai, China.
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