Oct 16, 2010 Technical poster presentations are being sought on all relevant electronics topics including design, materials, assembly, processes and equipment. Submissions in the areas of printed electronics, package on package assembly, solar cell assembly, advanced substrates, reliability and lead-free assembly are especially encouraged. An abstract of up to 300 words summarizing technical and previously unpublished, noncommercial work covering case histories, research and discoveries should be submitted by February 18, 2011 to http://www.IPCAPEXEXPO.org/CFPosters.
For more information on poster submission, or if there is any other interest in participation in the 2011 IPC Shows, visit http://www.IPCAPEXEXPO.org/CFPosters or contact Greg Munie, Ph.D., IPC conference director, at GregMunie@ipc.org, or Toya Richardson, IPC technical administrative assistant, at ToyaRichardson@ipc.org.
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.
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