Equipment will include the PacLine 2000 A50, which is capable of bumping 600K wafers/year, according to Dr. Thorsten Teutsch, CTO. Pac Tech will employ its new SB2-Jet solder ball equipment for solder ball bumping at the facility. [pactech.de]
Pac Tech USA Offering Contract Wafer Bumping, Stencil Services
Jan 27, 2003
Santa Clara, Calif.-Pac Tech USA has begun offering contract wafer bumping and solder-stencil printing services at a new facility within the company's U.S. headquarters, 328 Martin Ave.
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