SMT, PCB Electronics Industry News

Enthone Expands ViaForm� Sales and Support Services

May 21, 2003

WEST HAVEN, Conn., May 20, 2003 - Enthone Inc., a Cookson Electronics Company, announced today that it will expand marketing and distribution of its ViaForm� copper damascene electrochemical deposition processes through an exclusive licensing and joint-development agreement with ATMI, Inc. (Nasdaq: ATMI) Danbury, Connecticut.

Under terms of the strategic partnership, ATMI will gain exclusive worldwide rights to use, distribute and sell products and services related to copper electrochemical deposition (Cu ECD) including ViaForm materials that Enthone will continue to manufacture.

Enthone ViaForm processes provide superior yield performance for the deposition of copper on semiconductor wafers, enhancing integration into the chemical-mechanical planarization (CMP) process to reduce product defects. Providing material-based products centered on the chemical vapor deposition process, ATMI offers a complete material lifecycle management program to improve process tool uptime through its "surround the semiconductor" manufacturing process.

"ATMI and Enthone share a strong commitment in helping customers reduce their total cost of ownership," said Steven J. Corbett, president, Enthone. "Through this alliance, we will jointly deliver technology that will enable customers to increase yields and productivity. Enthone will back ATMI's technical support organization with world-class research and manufacturing capability, providing our mutual customers with unmatched service, support and supply," Corbett said.

"Our strategic partnership with Enthone makes ATMI the leading supplier of all the key components - materials, bath analysis, delivery, and environmental systems - necessary to improve process efficiency around the copper plating tool," said Doug Neugold, president, ATMI. "Enthone is the leader in semiconductor plating materials at 130 nanometers, with new products designed to lead the market at the 90 and 65 nanometer nodes. We believe that, with Enthone's copper materials, ATMI is the leader in comprehensive copper process efficiency solutions that improve yield, productivity, and cost of ownership," Neugold said.

"This clearly is a customer-focused partnership between two semiconductor application specialists," Corbett added. "The combination of Enthone's R&D resources coupled with ATMI's global support team of more than 300 sales and process experts will bring enabling technologies to customers efficiently. In essence, we're aligning two very compatible infrastructures to deliver best-in-class chemistry, metrology and material delivery systems worldwide."

About ATMI

ATMI provides specialty materials, and related equipment and services, to the worldwide semiconductor industry. As the Source of Semiconductor Process Efficiency, ATMI helps customers improve wafer yields and lower operating costs. For more information, please visit http://www.atmi.com.

About Enthone

Enthone Inc., is a business of Cookson Electronics PWB Materials & Chemistry. The company is a worldwide, leading supplier of high-performance specialty chemicals and coatings used in the electronics and surface finishing industries. Enthone manufactures, markets and distributes functional, decorative and electronic processes used in printed wiring board, semiconductor, automotive, aerospace, jewelry, and hardware and plumbing applications. The group includes Polyclad Laminates, one of the world's leading manufacturers of laminates, prepregs and resin coated copper foils used in printed wiring boards. For more information, please visit http://www.cooksonelectronics.com.

� ViaForm is a registered trademark of Enthone Inc.

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